The U.S. Department of Commerce (DOC) has issued a notice that will seek applications for research and development activities through the CHIPS and Science Act to accelerate domestic advanced packaging substrates and substrate materials.
The CHIPS Act will allot about $300 million in funding across multiple technologies ranging from semiconductor-based to glass and organics. This is the third funding opportunity focused on R&D through the CHIPS Act.
The funding it spart of the $11 billion that the DOC is administering to advance domestic semiconductor R&D in the U.S.
“CHIPS for America is delivering on its vision to make sure new leading-edge chip architectures can be invented in our research labs, designed for every end-use application, manufactured at scale, and packaged with the most advanced technologies,” said Gina Raimondo, U.S. Secretary of Commerce. “Within a decade, research and activities funded by this advanced packaging program, coupled with CHIPS manufacturing incentives, will establish a vibrant, self-sustaining, and resilient onshore packaging industry, helping ensure our country is a leader in advanced semiconductor manufacturing.”
The funding activities will include:
- Basic and applied research
- Substrate and demonstration device development
- Commercial viability and domestic manufacturing
- Integrated workforce education and training
- Pilot-level substrate production
