As part of its proven high-performance, high-density SMP and SMPM series, Amphenol SV Microwave has introduced pre-tinned, de-golded printed circuit board (PCB) connectors. These connectors utilize a unique and proprietary method for removing gold in the solder area of radio frequency (RF) connectors. The automated de-golding process mitigates undesirable remnants of gold plating in the solder joint.
Excess gold in a solder joint can create a gold-tin compound and result in gold striations in the solder joint that are brittle and susceptible to breakage under mechanical stress (shock and vibration). For this reason,
designers of high vibration and extreme movement RF PCBs often require there to be a minimal amount of gold in a solder joint.
The process developed by Amphenol SV Microwave removes gold in the soldered area per J-STD-001 to improve reliability of the solder joint. The connectors are optimized for pre-tinning in the design stage by modifying the connector body so it can be fixtured effectively. Gold can be thoroughly removed from the solderable area, including nearby areas that may be prone to capillary effect wicking.
These connectors are ideal for use in military and aerospace radar transmit/receive units, space and high-reliability communications, GPS applications, high vibration/extreme temperature applications, embedded computing and other applications requiring de-golding.
