Ironwood Electronics has recently introduced a new ball grid array (BGA) socket design using high performance elastomer capable of 94 GHz, very low inductance and wide temperature applications.
The GT-BGA-2135 socket is designed for 21 mm x21 mm package size and operates at bandwidths up to 94 GHz with less than 1 dB of insertion loss. The socket is designed to dissipate 8.5 W using a heat sink compression 
Source: Ironwood Electronicsscrew and an axial flow fan. The contact resistance is typically 30 milliohms per pin.
The socket is mounted on the target PCB with no soldering, and uses very small real estate allowing capacitors/resistors to be placed close by. Other passive components can be placed on the back side of the PCB by creating custom cutouts in the stiffener plate. The socket is constructed with a sliding lid, which incorporates a quick insertion method so that ICs can be changed out quickly. To use, place the device inside the socket, slide the lid and apply downward pressure by turning the compression screw bracket mounted on top of the fan.
The GT-BGA-2135 socket is constructed with high performance and low inductance elastomer contactor. The temperature range is -55° C to 160° C and the device works with ICs such as 840 BGA, 21 mm x 21 mm with 29 x 29 array with 0.65 mm pitch.
Pricing for the GT-BGA-2135 is $1,360 with reduced pricing available depending on quantity required.
