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The Best PCB Material for High-Speed Applications
Supplier: Summit InterconnectThe selection of PCB materials is critical to achieving optimal electrical performance for high-frequency data transmission, RF systems, and telecommunications infrastructure. Choosing the right material also requires alignment with applicable IPC design, material, and performance standards. -
Cable & Harness Assembly Services for Power
Supplier: Conax TechnologiesFor over 70 years, Conax has worked directly with industry leaders to custom design, build, test, and deliver high-quality cable and harness assemblies and temperature sensors for a wide variety of engines and applications in the power generation industry. -
PCB's for mission-critical applications
Supplier: Summit InterconnectSummit Interconnect builds advanced printed circuit boards that power aerospace and defense systems where performance, precision, and compliance are essential. From radar and avionics to satellites and secure communications, our facilities are engineered to deliver consistent, reliable quality at any altitude. -
Sheet Metal Processing
Supplier: TPS Elektronik GmbHFrom the drawing to the tested series: We manufacture sheet metal parts and assemblies Fast, repeatable and documented – incl. DFM feedback, initial sample inspection and optionally PPAP. -
High-Density 6-Layer FR4 PCB
Supplier: FX PCB Co., Ltd.Premium 6-layer FR4 PCB designed for high-speed signal transmission, multilayer routing, and reliable performance in modern electronics, ideal for communication, computing, and industrial applications. -
EMS Shop
Supplier: TPS Elektronik GmbHTPS Elektronik GmbH specializes in the development of hardware and software applications for power electronics. Applications such as AC and DC power sources, charging stations, on-board chargers (OBCs), photovoltaic inverters, battery charging and discharging tests, power conversion system (PCS) storage management, etc., are part of our scope, with power levels ranging from a few hundred... -
Troubleshoot and Prevent EMI Problems with E-Labs
Supplier: E-Labs, Inc.Electromagnetic interference can be a complex issue, stemming from electrical or mechanical design flaws, self-compatibility issues, or improper field installations. At E-Labs, our experienced EMI engineers can identify, isolate, and resolve these problems before they affect your units under testing's performance. -
Standard to Complex Rigid PCBs
Supplier: Summit InterconnectWhether you need 2 or 4-layer boards or have a complex HDI designs, Summits's integrated network of fabrication facilities have the experience necessary to manufacture your rigid PCB designs to exact specifications. -
The Benefits of Via Fill
Supplier: Summit InterconnectImproved reliability by reducing the risk of trapped air or liquids Tighter BGA pitches and higher density interconnects by allowing for via-in-pad instead of dog bone designs. Reliable filled & stacked via constructions. Planar copper surfaces above filled via for more reliable surface mounts & increased assembly yields. Enhanced.... -
Using Blind, Buried, and Stacked Vias
Supplier: Summit InterconnectUsing Blind, Buried, and Stacked Vias on Complex Designs Incorporating High Density Interconnect (HDI) structures is commonly utilized on advanced designs as a way to overcome space issues resulting from high I/O, fine pitch components.







