Product Watch

Summit Interconnect builds advanced printed circuit boards that power aerospace and defense systems where performance, precision, and compliance are essential. From radar and avionics to satellites and secure communications, our facilities are engineered to deliver consistent, reliable quality at any altitude.

From the drawing to the tested series: We manufacture sheet metal parts and assemblies Fast, repeatable and documented – incl. DFM feedback, initial sample inspection and optionally PPAP.

TPS Elektronik GmbH specializes in the development of hardware and software applications for power electronics. Applications such as AC and DC power sources, charging stations, on-board chargers (OBCs), photovoltaic inverters, battery charging and discharging tests, power conversion system (PCS) storage management, etc., are part of our scope, with power levels ranging from a few hundred...

Electromagnetic interference can be a complex issue, stemming from electrical or mechanical design flaws, self-compatibility issues, or improper field installations. At E-Labs, our experienced EMI engineers can identify, isolate, and resolve these problems before they affect your units under testing's performance.

Whether you need 2 or 4-layer boards or have a complex HDI designs, Summits's integrated network of fabrication facilities have the experience necessary to manufacture your rigid PCB designs to exact specifications.

Improved reliability by reducing the risk of trapped air or liquids Tighter BGA pitches and higher density interconnects by allowing for via-in-pad instead of dog bone designs. Reliable filled & stacked via constructions. Planar copper surfaces above filled via for more reliable surface mounts & increased assembly yields. Enhanced....

Using Blind, Buried, and Stacked Vias on Complex Designs Incorporating High Density Interconnect (HDI) structures is commonly utilized on advanced designs as a way to overcome space issues resulting from high I/O, fine pitch components.

Backdrilling is a cost-effective method to improve signal integrity without adding costly additional sub-lamination structures. This process removes the unneeded portion of a via barrel that can cause signal reflections at high speed data rates, or on high frequency RF designs.