Worldwide sales of semiconductor materials declined 3 percent to $43.5 billion in 2013 compared to 2012, marking the second straight year that revenue dropped, according to trade association SEMI.
Total wafer fabrication materials in 2013 totaled $22.76 billion, down from $23.44 billion in 2012. Semiconductor packaging materials in 2013 fell to $20.7 billion from $21.36 billion, the association said. The decline occurred despite 5 percent growth in the overall semiconductor market, SEMI noted.
Contributing to the semiconductor materials revenue drop were substantial declines in silicon revenue and advanced substrates and bonding wire sales, the association said.
For the fourth straight year, Taiwan was the largest consumer of semiconductor materials because of its large foundry business and advanced packaging base, although materials sales were flat. Sales in Taiwan totaled $8.96 billion in 2013, according to SEMI. The materials market in North America also stayed flat at $4.75 billion.
The semiconductor materials markets in China and Europe increased 4 percent in 2013, benefiting from strength in wafer fab materials, the association said. However, the materials market in Japan contracted 12 percent, while the South Korean market fell 4 percent. The “rest of the world” segment, which includes Singapore, Malaysia, the Philippines and other areas of Southeast Asia, declined 6 percent, according to SEMI.
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