Overview / Main Features
The HTC Legend (introduced during the Mobile World Congress 2010) was a fast follow on to the Google Nexus One device (also manufactured by HTC) that featured the similar AMOLED display technology and runs Android 2.1. HTC promoted its revamped Sense UI overlay as another key differentiator on the Legend that also features an all-aluminum unibody design [as the Nexus One].
The dual band UMTS / quad band GSM is HSDPA data capable smartphone is powered not by the premium Qualcomm SnapDragon processor but the more affordable MSM7227 baseband processor. Beyond this slight differences, the Legend share many similarities between itself and the Google Nexus One design.
Per press release, first release on Vodafone in June of 2010.
Pricing - At the time of writing (Aug. 2010), an unsubsidized and unlocked HTC Legend can be purchased for approximately $480.
Availability - assumed global
For the purposes of this teardown analysis, we have assumed a lifetime production volume of 1.5M units.
As a reminder, teardown volume production assumptions are primarily used for our cost analysis in terms of amortized NRE and tooling costs, especially for custom components specific to the model being analyzed (mechanical components especially). Unless assumed volumes are different by an order of magnitude, minor changes in volume (say 1 million vs. 2) rarely have a large net effect on our final analysis because of this.
Main Cost Drivers Representing ~80% of total materials cost
Samsung Mobile Display - AMS320FS03 - Display Module Value Line Item - 3.2' Diagonal, 16.7M Color AMOLED, 320 x 480 Pixels
Qualcomm - MSM7227 - Baseband Processor - Quad-Band GSM/EDGE, UMTS, HSDPA 7.2Mbps, HSUPA 5.76Mbps, Bluetooth 2.1, GPS, 600MHz ARM Core CPU w/ 320MHz Application DSP, 400MHz Modem Processor & Hardware-Accelerated 3D Graphics
Samsung Semiconductor - KA1000012M-BJTT - MCP - 4Gb NAND Flash + 3Gb Mobile SDRAM (Estimated)
Touchscreen Assembly / Display Window - 3.2' Capacitive, ITO Film Over Glass Faceplate, Painted
Camera Module Value Line Item - 5MP, CMOS, 1/4' Format, Auto Focus Lens
Texas Instruments - WL1271A - Bluetooth/FM/WLAN - Single Chip, IEEE802.11b/g/n, Bluetooth V2.1+EDR, 65nm, FM Radio Transceiver
Kingston - SDC/2GB - MicroSD Memory Card - 2GB
Battery - Li-Ion, 3.7V, 1300mAh
UniMicron Technology - 8-Layer - FR4/RCF HDI - 2+4+2
Qualcomm - PM7540 - Power Management IC - w/ Integrated USB Transceiver
Qualcomm - RTR6285 - RF Transceiver - ZIF, Quad-Band GSM/EDGE, Tri-Band UMTS Transceiver, HSDPA, w/ Integrated GPS Receiver & Receive Diversity
Enclosure, Main, Housing - Extruded/Machined Aluminum Unibody, Printed
Handsfree Accessory - Stereo, w/ Media Control Button, w/ Label & Rubber Band & Plastic Clip
TC P300 - Charger - 5V, 1A, AC to USB Type A
Synaptics - Touchscreen Controller
Skyworks - SKY77336-12 - PAM - Quad-Band GSM/GPRS/EDGE
CrucialTec - Optical Trackpad Module Value Line Item
Total BOM Cost $132.18
What Is Not Included in our Cost Analysis
The total materials and manufacturing costs reported in this analysis reflect ONLY the direct materials cost (from component vendors and assorted EMS providers), AND manufacturing with basic test. Not included in this analysis are costs above and beyond the material manufacture of the core device itself - cost of intellectual property, royalties and licensing fees (those not already included into the per component price), software, software loading and test, shipping, logistics marketing and other channel costs including not only EMS provider and the OEM's margin, but that of other resellers. Our cost analysis is meant to focus on those costs incurred in the manufacture of the core device and exceptionally in some circumstances the packaging and literature as well.
Country of Origin / Volume Assumptions
Based on markings, the unit was assembled in Taiwan. Furthermore, we have assumed that custom mechanicals (plastics, metals, etc.) were also sourced in Taiwan.
Country of origin assumptions relate directly to the associated cost of manufacturing, where calculated by iSuppli. In the cases of 'finished' sub-assemblies (such as display module), we do not calculate internal manufacturing costs, but rather assess the market price of the finished product in which case country of origin assumptions may or may not have a direct effect on pricing.
Remember also that labor rates are applied directly only to hand inserted components and systems in our bill of materials, and although regional assumptions do, these new rates do not have a direct effect on our modeled calculations of placement costs for automated SMD assembly lines. "Auto inserted components (such as SMT components) placement costs are calculated by an iSuppli algorithm which allocates a cost per component based on the size and pincount of the device. This calculation is affected by country or region of origin as well.
Design for Manufacturing / Device Complexity
The HTC Legend has an overall component count of 1005 (excluding box contents), of which 750 components reside on the Main PCB assembly. Compared to other smartphones we've analyzed in the past, the Legend occupies the upper ranges of the complexity curve (>1000 parts).
Component counts have a direct bearing on the overall manufacturing cycle times and costs, and also can increase or decrease overall yields and re-work. Our calculations of manufacturing costs factor counts and more qualitative complexities in the design. The cost of manufacturing is also, to some extent, decreased in this case because of assumed labor rate applied for Taiwan.
Note that manual labor has a much smaller effect on auto-insertion assembly lines (for the Main PCB, for example), where manufacturing costs are much more capital equipment intensive and driven by these investment costs.
Here is a summary of the major components used in the HTC Legend design:
- Baseband Processor - Qualcomm - MSM7227
Battery / Power Management
- Power Management IC - Qualcomm -PM7540
- Samsung Semiconductor - KA1000012M-BJTT - 4Gb NAND Flash + 3Gb Mobile SDRAM (Estimated)
Bluetooth / FM / WLAN
- Bluetooth/FM/WLAN IC - Texas Instruments - WL1271A
- RF Transceiver IC - Qualcomm -RTR6285
- Touchscreen Controller - Atmel -ATmega88PA-MMH
- Display Module - Samsung Mobile Display - AMS320FS03 (3.2' Diagonal, 16.7M Color AMOLED, 320 x 480 Pixels