HTC Legend A6363 Mobile Phone Teardown

Overview / Main Features

The HTC Legend (introduced during the Mobile World Congress 2010) was a fast follow on to the Google Nexus One device (also manufactured by HTC) that featured the similar AMOLED display technology and runs Android 2.1. HTC promoted its revamped Sense UI overlay as another key differentiator on the Legend that also features an all-aluminum unibody design [as the Nexus One].

The dual band UMTS / quad band GSM is HSDPA data capable smartphone is powered not by the premium Qualcomm SnapDragon processor but the more affordable MSM7227 baseband processor. Beyond this slight differences, the Legend share many similarities between itself and the Google Nexus One design.

HTC Legend A6363 Mobile Phone Main Image

Smartphone Users

Released

Per press release, first release on Vodafone in June of 2010.

HTC Legend A6363 Mobile Phone - Main PCB Top

Pricing - At the time of writing (Aug. 2010), an unsubsidized and unlocked HTC Legend can be purchased for approximately $480.

Availability - assumed global

Volume Estimations

For the purposes of this teardown analysis, we have assumed a lifetime production volume of 1.5M units.

As a reminder, teardown volume production assumptions are primarily used for our cost analysis in terms of amortized NRE and tooling costs, especially for custom components specific to the model being analyzed (mechanical components especially). Unless assumed volumes are different by an order of magnitude, minor changes in volume (say 1 million vs. 2) rarely have a large net effect on our final analysis because of this.

HTC Legend A6363 Mobile Phone - Main PCB Bottom

Main Cost Drivers Representing ~80% of total materials cost

Samsung Mobile Display - AMS320FS03 - Display Module Value Line Item - 3.2' Diagonal, 16.7M Color AMOLED, 320 x 480 Pixels

Qualcomm - MSM7227 - Baseband Processor - Quad-Band GSM/EDGE, UMTS, HSDPA 7.2Mbps, HSUPA 5.76Mbps, Bluetooth 2.1, GPS, 600MHz ARM Core CPU w/ 320MHz Application DSP, 400MHz Modem Processor & Hardware-Accelerated 3D Graphics

Samsung Semiconductor - KA1000012M-BJTT - MCP - 4Gb NAND Flash + 3Gb Mobile SDRAM (Estimated)

Touchscreen Assembly / Display Window - 3.2' Capacitive, ITO Film Over Glass Faceplate, Painted

Camera Module Value Line Item - 5MP, CMOS, 1/4' Format, Auto Focus Lens

Texas Instruments - WL1271A - Bluetooth/FM/WLAN - Single Chip, IEEE802.11b/g/n, Bluetooth V2.1+EDR, 65nm, FM Radio Transceiver

Kingston - SDC/2GB - MicroSD Memory Card - 2GB

Battery - Li-Ion, 3.7V, 1300mAh

UniMicron Technology - 8-Layer - FR4/RCF HDI - 2+4+2

Qualcomm - PM7540 - Power Management IC - w/ Integrated USB Transceiver

Qualcomm - RTR6285 - RF Transceiver - ZIF, Quad-Band GSM/EDGE, Tri-Band UMTS Transceiver, HSDPA, w/ Integrated GPS Receiver & Receive Diversity

Enclosure, Main, Housing - Extruded/Machined Aluminum Unibody, Printed

Handsfree Accessory - Stereo, w/ Media Control Button, w/ Label & Rubber Band & Plastic Clip

TC P300 - Charger - 5V, 1A, AC to USB Type A

Synaptics - Touchscreen Controller

Skyworks - SKY77336-12 - PAM - Quad-Band GSM/GPRS/EDGE

CrucialTec - Optical Trackpad Module Value Line Item

Total BOM Cost $132.18

HTC Legend A6363 Mobile Phone Cost Analysis

What Is Not Included in our Cost Analysis

The total materials and manufacturing costs reported in this analysis reflect ONLY the direct materials cost (from component vendors and assorted EMS providers), AND manufacturing with basic test. Not included in this analysis are costs above and beyond the material manufacture of the core device itself - cost of intellectual property, royalties and licensing fees (those not already included into the per component price), software, software loading and test, shipping, logistics marketing and other channel costs including not only EMS provider and the OEM's margin, but that of other resellers. Our cost analysis is meant to focus on those costs incurred in the manufacture of the core device and exceptionally in some circumstances the packaging and literature as well.

Manufacturing Notes

Country of Origin / Volume Assumptions

Based on markings, the unit was assembled in Taiwan. Furthermore, we have assumed that custom mechanicals (plastics, metals, etc.) were also sourced in Taiwan.

Country of origin assumptions relate directly to the associated cost of manufacturing, where calculated by iSuppli. In the cases of 'finished' sub-assemblies (such as display module), we do not calculate internal manufacturing costs, but rather assess the market price of the finished product in which case country of origin assumptions may or may not have a direct effect on pricing.

Remember also that labor rates are applied directly only to hand inserted components and systems in our bill of materials, and although regional assumptions do, these new rates do not have a direct effect on our modeled calculations of placement costs for automated SMD assembly lines. "Auto inserted components (such as SMT components) placement costs are calculated by an iSuppli algorithm which allocates a cost per component based on the size and pincount of the device. This calculation is affected by country or region of origin as well.

HTC Legend A6363 Mobile Phone - Disassembly View 1

Design for Manufacturing / Device Complexity

The HTC Legend has an overall component count of 1005 (excluding box contents), of which 750 components reside on the Main PCB assembly. Compared to other smartphones we've analyzed in the past, the Legend occupies the upper ranges of the complexity curve (>1000 parts).

Component counts have a direct bearing on the overall manufacturing cycle times and costs, and also can increase or decrease overall yields and re-work. Our calculations of manufacturing costs factor counts and more qualitative complexities in the design. The cost of manufacturing is also, to some extent, decreased in this case because of assumed labor rate applied for Taiwan.

Note that manual labor has a much smaller effect on auto-insertion assembly lines (for the Main PCB, for example), where manufacturing costs are much more capital equipment intensive and driven by these investment costs.

Design Notes

Here is a summary of the major components used in the HTC Legend design:

Main PCB

Baseband

• Baseband Processor - Qualcomm - MSM7227

Battery / Power Management

• Power Management IC - Qualcomm -PM7540

Memory

• Samsung Semiconductor - KA1000012M-BJTT - 4Gb NAND Flash + 3Gb Mobile SDRAM (Estimated)

Bluetooth / FM / WLAN

• Bluetooth/FM/WLAN IC - Texas Instruments - WL1271A

RF Transceiver

• RF Transceiver IC - Qualcomm -RTR6285

User Interface

• Touchscreen Controller - Atmel -ATmega88PA-MMH

Display

• Display Module - Samsung Mobile Display - AMS320FS03 (3.2' Diagonal, 16.7M Color AMOLED, 320 x 480 Pixels

"

HTC Legend A6363 Mobile Phone - Box Contents