Mobile Devices

Pantech Impact P7000 Mobile Phone Teardown

11 August 2010
The following is an overview of a teardown analysis conducted by IHS Benchmarking.

Overview / Main Features

The Pantech Impact P7000 is a clamshell full QWERTY messaging phone designed for the AT&T network. The tri-band UMTS / quad-band GSM mobile phone features a 2.6 inch primary color display along with a touch sensitive dial pad and OLED secondary display. The device targets the youth market segment with its messaging oriented design and functionality. The Pantech also features Bluetooth connectivity, GPS Navigation, 2.0 MP camera, and expandable memory via microSD card slot. From a design perspective, the Pantech P7000 is primarily a Qualcomm design featuring a QSC6270 baseband as well as BTS4025 bluetooth and RGR6204 GPS.

Pantech Impact P7000 Mobile Phone Main ImagePantech Impact P7000 Mobile Phone Main Image

Target Market

Low-cost Messaging Phone

Released

Per press release, first release on the AT&T network on November 2009 .

Pantech Impact P7000 Mobile Phone - Main PCB TopPantech Impact P7000 Mobile Phone - Main PCB Top

Pricing and Availability

Pricing - At the time of writing (May 2010), the Pantech is offered on AT&T's website for $249 "no commitment or $39 with a 2 year contract.

Availability - North America

Volume Estimations

For the purposes of this teardown analysis, we have assumed a lifetime production volume of 2M units.

As a reminder, teardown volume production assumptions are primarily used for our cost analysis in terms of amortized NRE and tooling costs, especially for custom components specific to the model being analyzed (mechanical components especially). Unless assumed volumes are different by an order of magnitude, minor changes in volume (say 1 million vs. 2) rarely have a large net effect on our final analysis because of this.

Pantech Impact P7000 Mobile Phone - Main PCB BottomPantech Impact P7000 Mobile Phone - Main PCB Bottom

Cost Notes

Main Cost Drivers Representing ~60% of total materials cost

Qualcomm - QSC6270 - Baseband Processor / RF Transceiver - Single-Chip, Quad-Band GSM/GPRS/EDGE, Tri-Band WCDMA, HSDPA 3.6 Mbps, Bluetooth, gpsOne, w/ Integrated Power Management & Multimedia Processor

Hynix - H8BCS0S10AAP-46M - MCP - 1Gb NAND Flash + 1Gb Mobile SDRAM (Estimated)

NEX Display - Primary Display Module Value Line Item - 2.6' Diagonal, 262K Color TFT, 400 x 240 Pixels

Board to Board - Receptacle, Gold Plated Contacts

Camera Module Value Line Item - 2.0MP CMOS, 1/4' Format, Fixed Lens

PTA-5070C9US - Charger - 5V, 700mA

Battery - Li-Ion, 3.7V, 930mAh, 3.4Wh

Secondary Display Module Value Line Item - 1.6' Diagonal, Monochrome OLED, 128 x 64 Pixels

2-Layer - Flex Kapton, Lead-Free

Qualcomm - BTS4025 - Bluetooth - SoC, V2.1+EDR

Qualcomm - RGR6240 - GPS Receiver - w/ LNA, VCO, & PLL

7-Layer - Flex Kapton, Lead-Free

QWERTY Keypad Assembly - Injection Molded Polycarbonate Keys, Painted & Printed & Chromed, on Silicone Rubber Substrate, w/ Stamped / Formed Metal Frame

Total BOM Cost $72.73

Pantech Impact P7000 Mobile Phone Cost AnalysisPantech Impact P7000 Mobile Phone Cost Analysis


What Is Not Included in our Cost Analysis

The total materials and manufacturing costs reported in this analysis reflect ONLY the direct materials cost (from component vendors and assorted EMS providers), AND manufacturing with basic test. Not included in this analysis are costs above and beyond the material manufacture of the core device itself - cost of intellectual property, royalties and licensing fees (those not already included into the per component price), software, software loading and test, shipping, logistics marketing and other channel costs including not only EMS provider and the OEM's margin, but that of other resellers. Our cost analysis is meant to focus on those costs incurred in the manufacture of the core device and exceptionally in some circumstances the packaging and literature as well.

Manufacturing Notes

Country of Origin / Volume Assumptions

Based on markings, the unit was assembled in Korea. Furthermore, we have assumed that custom mechanicals (plastics, metals, etc.) were also sourced in Korea.

Country of origin assumptions relate directly to the associated cost of manufacturing, where calculated by iSuppli. In the cases of 'finished' sub-assemblies (such as display module), we do not calculate internal manufacturing costs, but rather assess the market price of the finished product in which case country of origin assumptions may or may not have a direct effect on pricing.

Remember also that labor rates are applied directly only to hand inserted components and systems in our bill of materials, and although regional assumptions do, these new rates do not have a direct effect on our modeled calculations of placement costs for automated SMD assembly lines. ""Auto" inserted components (such as SMT components) placement costs are calculated by an iSuppli algorithm which allocates a cost per component based on the size and pincount of the device. This calculation is affected by country or region of origin as well.

Design for Manufacturing / Device Complexity

The Pantech P7000 has an overall component count of 820 (excluding box contents), of which 440 components reside on the Main PCB assembly.

Component counts have a direct bearing on the overall manufacturing cycle times and costs, and also can increase or decrease overall yields and re-work. Our calculations of manufacturing costs factor counts and more qualitative complexities in the design. The cost of manufacturing is also, to some extent, decreased in this case because of assumed labor rate applied for Korea.

Note that manual labor has a much smaller effect on auto-insertion assembly lines (for the Main PCB, for example), where manufacturing costs are much more capital equipment intensive and driven by these investment costs.

Pantech Impact P7000 Mobile Phone - Disassembly 1Pantech Impact P7000 Mobile Phone - Disassembly 1

Design Notes

Here is a summary of the major components used in the Pantech Impact P7000 design:

Main PCB

Baseband / RF Transceiver

  • Baseband Processor - Qualcomm - QSC6270
  • Antenna Switch - Sony - CXM3529XR

Memory

  • Hynix - H8BCS0S10AAP-46M - 1Gb NAND Flash + 1Gb Mobile SDRAM (Estimated)

Bluetooth

  • Bluetooth IC - Qualcomm - BTS4025

GPS

  • GPS Receiver - Qualcomm - RGR6240

Power Amplifier

  • PAM - Skyworks - SKY77336-13

Display

  • Primary Display Module - 2.6' Diagonal, 262K Color TFT, 400 x 240 Pixels
  • Secondary Display Module - 1.6' Diagonal, Monochrome OLED, 128 x 64 Pixels

Pantech Impact P7000 Mobile Phone - Box ContentsPantech Impact P7000 Mobile Phone - Box Contents



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