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Mobile Devices

HP Compaq CQ61-410US Notebook Computer Teardown

08 September 2010
The following is an overview of a teardown analysis conducted by IHS Technology Teardown Services.

Overview / Main Features

The HP Compaq CQ61-410US is a 15.6 inch value notebook computer based on the AMD Sempron M120 CPU and RS880M chipset. The laptop comes with 2 GB of DDR2-800 RAM on SO-DIMM module, 250GB hard disk drive, DVD-RW optical drive, WLAN half miniPCIe card and a 6-cell battery.

HP Compaq CQ61-410US Notebook Computer Main ImageHP Compaq CQ61-410US Notebook Computer Main Image

Target Market

Low cost computing segment

Released

2009

HP Compaq CQ61-410US Notebook Computer - Motherboard TopHP Compaq CQ61-410US Notebook Computer - Motherboard Top

Pricing and Availability

Pricing - Approximately $430 USD at retail

Availability - Global (assumed)

Volume Estimations

For the purposes of this teardown analysis, we have assumed a lifetime production volume of 3.6M units.

As a reminder, teardown volume production assumptions are primarily used for our cost analysis in terms of amortized NRE and tooling costs, especially for custom components specific to the model being analyzed (mechanical components especially). Unless assumed volumes are different by an order of magnitude, minor changes in volume (say 1 million vs. 2) rarely have a large net effect on our final analysis because of this.

HP Compaq CQ61-410US Notebook Computer - Motherboard BottomHP Compaq CQ61-410US Notebook Computer - Motherboard Bottom


Cost Notes

Main Cost Drivers Representing ~80% of total materials cost

Samsung - LTN156AT01 - Display Module Value Line Item - 15.6' TFT LCD, TN Mode, 1366 x 768 Pixels, 0.252mm x 0.252mm Pixel Size, 262K Colors, 600:1 Contrast Ratio, 220cd/m^2 Brightness, 25ms Response Time, Active Area: 344.2mm x 193.5mm, CCFL Backlight

Toshiba Storage Device - MK2556GSY - Hard Drive - 250GB, 2.5' SATA 3Gb/s, 5400RPM, 8MB Buffer

Micron Technology - MT16HTF25664HY-800J2 - SO-DIMM DDR2-800 - 2GB, 256Mx64 1.8V

Hitachi-LG Data Storage - GT30L - CD/DVD RW Drive - Slim Internal Type, Tray Load, SATA

AMD - SMM120SB012GQ - CPU - AMD Sempron M120, 2.1GHz, 512KB L2 Cache, 45nm

Celxpert (Kunshan) Energy Co., Ltd. - Battery Pack - Li-Ion, 6-Cell, 10.8V, 4350mAh, 47Wh

AMD - 216-0752001 - Northbridge - AMD RS880M Chipset, Integrated Mobility Radeon HD 4200 Graphics Controller, 55nm

Delta Electronics - ADP-65HB - AC Adapter - 18.5V, 3.5A, 65W, w/ 1.9m Cord, Velcro Strap & Removable Plug Unit

HannStar - 6-Layer - FR4

Keyboard Assembly - Injection Molded Plastic Keys, Mounted on Stamped Metal Backing Plate, w/ Interconnect Flex, Clear Polycarbonate Insulator, & 5 Metal Standoffs

Enclosure, Main, Bottom - Injection Molded ABS Polycarbonate, w/ ESD/EMI Coating & 18 Brass Inserts

AMD - 218-0660017 - Southbridge - AMD SB710 I/O Controller Hub

Atheros - AR5B95 - WLAN Half Mini PCIe Module Value Line Item - IEEE802.11b/g/n, Contains AR9285 Single-Chip Solution

Total BOM Cost $337.98

HP Compaq CQ61-410US Notebook Computer Cost AnalysisHP Compaq CQ61-410US Notebook Computer Cost Analysis


What Is Not Included in our Cost Analysis

The total materials and manufacturing costs reported in this analysis reflect ONLY the direct materials cost (from component vendors and assorted EMS providers), AND manufacturing with basic test. Not included in this analysis are costs above and beyond the material manufacture of the core device itself - cost of intellectual property, royalties and licensing fees (those not already included into the per component price), software, software loading and test, shipping, logistics marketing and other channel costs including not only EMS provider and the OEM's margin, but that of other resellers. Our cost analysis is meant to focus on those costs incurred in the manufacture of the core device and exceptionally in some circumstances the packaging and literature as well.

Manufacturing Notes

Country of Origin / Volume Assumptions

Based on markings, the unit was assembled in China. Furthermore, we have assumed that custom mechanicals (plastics, metals, etc.) were also sourced in China.

Country of origin assumptions relate directly to the associated cost of manufacturing, where calculated by iSuppli. In the cases of 'finished' sub-assemblies (such as miniPCIe card), we do not calculate internal manufacturing costs, but rather assess the market price of the finished product in which case country of origin assumptions may or may not have a direct effect on pricing.

Remember also that labor rates are applied directly only to hand inserted components and systems in our bill of materials, and although regional assumptions do, these new rates do not have a direct effect on our modeled calculations of placement costs for automated SMD assembly lines. "Auto inserted components (such as SMT components) placement costs are calculated by an iSuppli algorithm which allocates a cost per component based on the size and pincount of the device. This calculation is affected by country or region of origin as well.

Design for Manufacturing / Device Complexity

The Compaq CQ61 notebook has an overall component count of 1616 excluding box contents.

Component counts have a direct bearing on the overall manufacturing cycle times and costs, and also can increase or decrease overall yields and re-work. Our calculations of manufacturing costs factor counts and more qualitative complexities in the design. The cost of manufacturing is also, to some extent, decreased in this case because of assumed labor rate applied for China.

Note that manual labor has a much smaller effect on auto-insertion assembly lines (for the Main PCB, for example), where manufacturing costs are much more capital equipment intensive and driven by these investment costs.

HP Compaq CQ61-410US Notebook Computer - Box ContentsHP Compaq CQ61-410US Notebook Computer - Box Contents



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