Mobile Devices

Nokia C6-00 Mobile Handset Teardown

07 February 2011
The following is an overview of a teardown analysis conducted by IHS Benchmarking.

Overview / Main Features

The Nokia C6 is a full slide-out QWERTY keypad smartphone design with touchscreen capabilities. It is based on the older Symbian S60 platform 5th edition (limited touch interface implementation). Just as the C7 represented Nokia's lower cost alternative to their flagship N8, the C6 is essentially the lower cost alternative to their previous flagship device, the N97. As opposed to its competitors, the C6 uses the older resistive touchscreen technology giving the C6 a rather dated user interface with respect to other smartphones on the market. Overall, the C6 is a dual-mode/quad-band GSM/UMTS device with a 3.2 inch display and 5MP camera.

Nokia C6-00 Mobile Handset Main ImageNokia C6-00 Mobile Handset Main Image
Target Market

Smartphone Category

Released

Q2 2010

Nokia C6-00 Mobile Handset - Main PCB TopNokia C6-00 Mobile Handset - Main PCB Top
Pricing and Availability

Pricing - The Nokia C6 is available unsubsidized from Nokia (UK) for approximately $400. This price point is consistent with past high end handsets from Nokia. Typically, the handset would likely be offered for free along with a fixed service contract by major carriers.

Availability - Europe & Asia

Volume Estimations

For the purposes of this teardown analysis, we have applied a lifetime production volume of approximately 2.5M units.

As a reminder, teardown volume production assumptions are primarily used for our cost analysis in terms of amortized NRE and tooling costs, especially for custom components specific to the model being analyzed (mechanical components especially). Unless assumed volumes are different by an order of magnitude, minor changes in volume (say 1 million vs. 2) rarely have a large net effect on our final analysis because of this.

Nokia C6-00 Mobile Handset - Main PCB BottomNokia C6-00 Mobile Handset - Main PCB Bottom
Cost Notes

Main Cost Drivers ~66% of Total Materials Cost

Sharp Microelectronics - LS032B3LX01E - Display Module Value Line Item - 3.2' Diagonal, 16.7M Color TFT, 360x640 Pixels

Samsung Semiconductor - K5W4G1GACM-BL60 - MCP - 4Gb OneNAND Flash + 1Gb Mobile DDR

Camera Module Value Line Item - 5.1MP CMOS, 1/3.2' Format, Auto Focus Lens

Texas Instruments - NMP #4377524 - DBB - Digital Baseband Processor

WLAN Module Value Line Item - 802.11 b/g

Texas Instruments - TMSDM500ID - Image Processor

MicroSD Memory Card - 2GB

Enclosure, Display, Bottom / Sliding Mechanism - Stamped / Formed Metal Plate, 2 Pieces, Spot-Welded, Painted, w/ Plastic Top & Pressed-In Brass Stud Insert, and Stamped / Fromed Metal Slider Plate, 2 Pieces, Spot-Welded, w/ 2 Plastic Guides, 3 Plastic Stoppers, 1 Pressed-In Brass Stud Insert, Integral Spring, & Black Mylar Insulator

Display Window / Touchscreen Assembly - 3.2' Diagonal, 4-Wire Resistive, ITO Film Over Polycarbonate Display Window, Painted, Printed, w/ Integral Flex PCB, & Board to Board Connector

Ibiden - 8-Layer - FR4/RCF HDI, 2+4+2, Lead-Free

BL-4J - Battery - Li-Ion, 3.7V, 1200mAh

Salcomp - AC-15E - Charger - 5V, 800mA, w/ 6ft Cord and Velcro Cord Wrap

Direct Materials + Manufacturing $110.22

Nokia C6-00 Mobile Handset Cost AnalysisNokia C6-00 Mobile Handset Cost Analysis


What Is Not Included in our Cost Analysis

The total materials and manufacturing costs reported in this analysis reflect ONLY the direct materials cost (from component vendors and assorted EMS providers), AND manufacturing with basic test. Not included in this analysis are costs above and beyond the material manufacture of the core device itself - cost of intellectual property, royalties and licensing fees (those not already included into the per component price), software, software loading and test, shipping, logistics marketing and other channel costs including not only EMS provider and the OEM's margin, but that of other resellers. Our cost analysis is meant to focus on those costs incurred in the manufacture of the core device and exceptionally in some circumstances the packaging and literature as well.

Manufacturing Notes

OEM/ODM/EMS Relationships / Manufacturing

Nokia maintains worldwide manufacturing operations in North America (Mexico), South America (Brazil), Asia Pacific region (Korea), Greater China, India and 4 other locations in both Eastern and Western Europe. Furthermore, iSuppli estimates that Nokia used 6 ODMs & EMS providers in 2008 with Foxconn, Elcoteq and Jabil making up roughly 15% of Nokia's overall manufacturing capacity.

Country of Origin / Volume Assumptions

Based on markings found on the device, the unit under analysis was likely assembled in China. Furthermore, we have assumed that custom mechanicals (plastics, metals, etc.) were also sourced in China.

Country of origin assumptions relate directly to the associated cost of manufacturing, where calculated by iSuppli. In the cases of 'finished' sub-assemblies (such as display), we do not calculate internal manufacturing costs, but rather assess the market price of the finished product in which case country of origin assumptions may or may not have a direct effect on pricing.

Remember also that labor rates are applied directly only to hand inserted components and systems in our bill of materials, and although regional assumptions do, these new rates do not have a direct effect on our modeled calculations of placement costs for automated SMD assembly lines. "Auto inserted components (such as SMT components) placement costs are calculated by an iSuppli algorithm which allocates a cost per component based on the size and pincount of the device. This calculation is affected by country or region of origin as well.

Nokia C6-00 Mobile Handset - Disassembly View 1Nokia C6-00 Mobile Handset - Disassembly View 1

Design for Manufacturing / Device Complexity

The Nokia C6 under analysis here has an overall component count of 710 (excluding box contents), of which, 562 reside on the main PCB. Nokia tends to have a lower component count that most other manufacturers in any category and the C6 is no exception. Competitive devices in this space can easily reach a complexity level of 1000 parts or more, especially if there are more complex flip / slide / swivel industrial designs involved.

Component counts have a direct bearing on the overall manufacturing cycle times and costs, and also can increase or decrease overall yields and re-work. Our calculations of manufacturing costs factor counts and more qualitative complexities in the design. The cost of manufacturing is also, to some extent, decreased in this case because of assumed labor rate applied for China.

Note that manual labor has a much smaller effect on auto-insertion assembly lines (for the Main PCB, for example), where manufacturing costs are much more capital equipment intensive and driven by these investment costs.

Design Notes

The C6-00 represents Nokia's previous generation Symbian S60 smartphone handset design dominated by TI and ST-Ericsson DBB and ABB. On the radio portion, the dual mode/quad band GSM/UMTS uses Skyworks PAM for WCDMA and a Renesas module for GSM.

Here is a summary of the major components used in the Nokia C6 Handset design:

Display

  • Display Module Value Line Item - 3.2' Diagonal, 16.7M Color TFT, 360x640 Pixels

Main PCB

Baseband / Power Management

  • DBB - Texas Instruments - NMP #4377524, Digital Baseband Processor
  • ABB - ST-Ericsson - NMP #4376035, Analog Baseband / Power Management
  • Power Management - ST-Ericsson - NMP #4376535, Battery Charger IC

RF / PA

  • RF Transceiver - ST-Ericsson - NMP #4380116, Quad-Band GSM/GPRS/EDGE, Dual-Band WCDMA/HSDPA/HSUPA 900/2100
  • PAM - Skyworks - SKY77431, Tri-Band, WCDMA 900/1900/2100
  • Transmit Module - Renesas - PF89008B, PAM, Quad-Band GSM/GPRS/EDGE, w/ Integrated Antenna Switch

BT / FM / GPS / WLAN

  • WLAN Baseband - Texas Instruments - WL1251B, Single Chip, 802.11b/g, Wilink 4.0, 90nm
  • Bluetooth / FM - Broadcom - BCM2048B0KUBG, Single Chip, V2.1+EDR, 0.13-micron, w/ FM+RDS Radio Receiver

User Interface

  • Image Processor - Texas Instruments - TMSDM500ID
  • LCD Controller - Toshiba Semiconductor - TC358732XBG, Support for 16-bit/18-bit/24-bit RGB Data Input, MIPI DBI Type B Interface and MIPI DPI Interface to Baseband, T-HSSI Interface to LCD, MIPI DBI Type C Output, up to VGA Resolution, w/ Flexible Image Buffer
  • Accelerometer - Analog Devices - ADXL345BCCZ, MEMS, 3-Axis, +-2g/4g/8g/16g, 13-Bit, Digital Output

Camera

  • Camera Module Value Line Item - 5.1MP CMOS, 1/3.2' Format, Auto Focus Lens

Nokia C6-00 Mobile Handset - Box ContentsNokia C6-00 Mobile Handset - Box Contents



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