Samsung SGH-i560 Mobile Phone Teardown

Main Features / Overview

The Samsung SGH-i560V is Vodafone's version of the SGH-i560 which is an advanced Symbian slider handset with relatively high-end features such as HSDPA 3.6 and a 3.1MP camera module (with even a QCIF secondary camera module for conference calling, etc.) and GPS functionality. Other features include a 2.4 inch diagonal TFT with 262K colors, Bluetooth 2.0 with A2DP, and FM radio.

Samsung SGH-i560 Mobile Phone Main Image

Higher-end mainstream consumers. Furthermore, based on Vodafone's footprint, regional market would be the Vodafone customer base in primarily Europe and former British Empire countries.

Released

Q4 2007 (releases date late Oct 2007 - only 2 weeks or so prior to the writing of this document).

Samsung SGH-i560 Mobile Phone - Main PCB Top

Unknown at the time of writing as unit was only just released.

Volume Estimations

For the purposes of this teardown, we estimate unit shipments for the Samsung SGH-i560 over the course of a 2-year production lifetime would be on an order of magnitude around 1 million units.

As a reminder, volume production assumptions are not meant to be necessarily 'market accurate', but are meant primarily to be used for our cost analysis in terms of amortized NRE and tooling costs, especially for custom components specific to the model being analyzed (mechanical components especially).

ISuppli's Design Forecast Tool (DFT) and Market Shares

As part of iSuppli's Design Forecast Tool (DFT), we forecast handset shipments by major design feature and manufacture, as well as the number of design starts a manufacturer will have by feature set.

From our Design Forecast Tool (DFT), we estimate shipments of 32 million HSDPA handsets in the 2007 global market; furthermore, we estimate shipments of 43 million 3 Megapixel camera phones in 2007 global market by the Samsung. We also estimate of that 81 million units from Samsung will have secondary cameras in the 2007 global market. Also, given that this phone features GPS functionality we have considered our own iSuppli estimates of 158 million GPS phones in 2007 global market by Samsung. Finally - we also have considered iSuppli estimates of Symbian handsets from Samsung, which we estimate to be at 78 million units in the 2007 global market by the manufacturer.

Function / Performance

No testing was performed on this unit.

Samsung SGH-i560 Mobile Phone Cost Analysis

Main Cost Drivers Representing ~72% of total materials cost as follows :

Qualcomm - MSM6260 - Baseband Processor - Single Chip, Quad-Band GSM/GPRS, GPS, UMTS, HSDPA 3.6Mbps, GPS & Bluetooth (Qty:1)

Texas instruments - OMAP2431 - Applications Processor - Integrated 330MHz ARM1136 RISC Core, AV Accelerator, TV Decode, 90nm (Qty:1)

Camera Module - 3.1MP CMOS, 1/4' Format - Fixed Lens (Qty:1)

Display Module - 2.4' Diagonal, 240 x 320 Pixels, 262K Color TFT (Qty:1)

Samsung Semiconductor - K5D1258DCA-A090000 - MCP - 512Mb NAND Flash + 256Mb Mobile SDRAM (Qty:1)

Samsung Semiconductor - KAT00F00RE-D477 - SDRAM - Mobile DDR, 512Mb (16M x 32), PoP (Qty:1)

Daeduck - Main PCB - 10-Layer - FR4/RCF HDI, 3+4+3, Lead-Free (Qty:1)

Texas instruments - TWL4030 - ABB / Power Management - Integrated Charger & USB OTG Transceiver, for OMAP2431 (Qty:1)

Qualcomm - RTR6285 - RF Transceiver - ZIF, Quad-Band GSM/EDGE & Tri-Band UMTS 800/1900/2100MHz Transceiver, GPS Receiver, Support Receive Diversity (Qty:1)

IDT - IDT70P258L55BYGI - SRAM - 128Kb (8K x 16), Dual-Port, 1.8V (Qty:1)

Qualcomm - PM6658 - Power Management IC w/ Integrated USB Transceiver (Qty:1)

Skyworks - SKY77519 - Transmit Module - PAM - Quad Band GSM/GPRS, w/ Integrated Antenna Switch Supporting 4 GSM Band & 1 WCDMA Band (Qty:1)

Camera Module (Secondary)- QCIF CMOS Fixed Lens (Qty:1)

Texas instruments - BRF6300 - Bluetooth - Single Chip Solution, V2.0 + EDR, 90nm (Qty:1)

Materials and Manufacturing $145.78

What Is Not Included in our Cost Analysis

The total materials and manufacturing costs reported in this analysis reflect ONLY the direct materials cost (from component vendors and assorted EMS providers), AND manufacturing with basic test. Not included in this analysis are costs above and beyond the material manufacture of the core device itself - cost of intellectual property, royalties and licensing fees (those not already included into the per component price), software, software loading and test, shipping, logistics marketing and other channel costs including not only EMS provider and the OEM's margin, but that of other resellers. Our cost analysis is meant to focus on those costs incurred in the manufacture of the core device and exceptionally in some circumstances the packaging and literature as well.

Manufacturing Notes

Samsung Relationships / Manufacturing

Based on our research, Samsung makes all their mobile phones in house. About 70% of their products are made in Korea and 30% are made in lower cost countries such as China and India.

Country of Origin / EMS provider

This product, as is typically the case from our experience, was labeled as made in Korea. Furthermore, we have assumed that for this model, that PCB was populated in lower cost Samsung operations in China, and that custom mechanicals (plastics and metals) were sourced locally as well in China to leverage the lower cost production in the region.

Country of origin assumptions relate directly to the associated cost of manufacturing, where calculated by iSuppli. In the cases of 'finished' sub-assemblies (such as Bluetooth modules or camera modules), we do not calculate internal manufacturing costs, but rather assess the market price of the finished product in which case country of origin assumptions may or may not have a direct effect on pricing.

Remember also that labor rates are applied directly only to hand inserted components and systems in our bill of materials, and although regional assumptions do, these new rates do not have a direct effect on our modeled calculations of placement costs for automated SMD assembly lines. "Auto inserted components (such as SMT components) placement costs are calculated by an iSuppli algorithm which allocates a cost per component based on the size and pincount of the device. This calculation is affected by country or region of origin as well.

Samsung SGH-i560 Mobile Phone - Main PCB Bottom

Design for Manufacturing / Device Complexity

Slider phones typically are mechanically more complex (as are clamshell phones) that monoblock designs. This is an inevitable consequence of the need for additional mechanisms and additional interconnect mechanisms (flex PCBs, etc.) to accommodate the 'split-level' electronic design. This design choice always adds component count and therefore cost. To further ad to this are additional features such as the Apple-esque 'clickwheel', for example, which may be becoming common in high end Samsung phones as we have recently seen others with similar design features.

Overall, the Samsung SGH-i560 has a total component count of 865 components, of which 122 are mechanical in nature. This puts the i560 within the design norms of other phones with similar form factor but could be considered above average in complexity. Having said that, component counts from other recently analyzed Samsung phones, this device is better integrated (the Blackjack had 935 components and the SGH-i620(v) 912).

The number of mechanical components usually is a direct driver of hand-assembly costs, whereas the electronic component count (and I/O count, density, etc.) are relative metrics for the more automated portion (namely SMT assembly) of manufacturing costs.

Component counts have a direct bearing on the overall manufacturing cycle times and costs, and also can increase or decrease overall yields and re-work. Our calculations of manufacturing costs factor counts and more qualitative complexities in the design.

Note that manual labor has a much smaller effect on auto-insertion assembly lines (for the Main PCB, for example), where manufacturing costs are much more capital equipment intensive and driven by these investment costs.

Design Notes

Main PCB

Applications Processor

• Samsung Semiconductor - KAT00F00RE-D477 - MCP - Package on Package
• Texas instruments - OMAP2431 - Integrated 330MHz ARM1136 RISC Core, AV Accelerator, TV Decode, 90nm

Baseband

• Baseband Processor - Qualcomm - MSM6260 - Single Chip, Quad-Band GSM/GPRS, GPS, UMTS, HSDPA 3.6Mbps, GPS & Bluetooth

Battery / Power Management

• 2 devices used here - one for OMAP support - the other for wireless chipset (Qualcomm) power management
• Power Management - Texas instruments - TWL4030 - Integrated Charger & USB OTG Transceiver, for OMAP2431
• Power Management IC - Qualcomm - PM6658 - w/ Integrated USB Transceiver

Memory

• MCP - Samsung Semiconductor - K5D1258DCA-A090000 - 512Mb NAND Flash + 256Mb Mobile SDRAM
• Note also the significant additional P-o-P memory in the Applications Processor functional area

RF/PA

• RF Transceiver - Qualcomm - RTR6285 - ZIF, Quad-Band GSM/EDGE & Tri-Band UMTS 800/1900/2100MHz Transceiver, GPS Receiver, Support Receive Diversity
• PAM - GSM/GPRS - Skyworks - SKY77519 - Transmit Module - PAM - Quad Band GSM/GPRS, w/ Integrated Antenna Switch Supporting 4 GSM Band & 1 WCDMA Band
• PAM - WCDMA - Anadigics - AWT6279RM20P8 - WCDMA 2100MHz, InGaP HBT

User Interface

• Bluetooth - Texas instruments - BRF6300 - Single Chip Solution, V2.0 + EDR, 90nm
• FM Radio Tuner - Silicon Laboratories - Si4702/3

Camera Module (Primary)

• Module - Manufacturer Unknown
• Image sensor - Micron Technology - MT9T013 - 3.1 MP, CMOS, 1/4' Format - 1.75 um x 1.75 um Pixel Size, 3.61mm x 2.72mm Active Image Area
• Image processor (on board) - Image Processor - Mtekvision - MV9317 - 5MP, w/ Real-Time Image Compression & Advanced Color Temperature Detection

Camera Module (Secondary)

• Module - Manufacturer Unknown
• Image sensor - QCIF, CMOS - 4.50um x 4.50um Pixel Size, 0.80mm x 0.65mm Active Image Area

Display Module

• 2.4' Diagonal, 262K Color TFT, 240 x 320 Pixels

"

Samsung SGH-i560 Mobile Phone - Enclosure Disassembly