Samsung SGH-F400 Mobile Phone Teardown

Overview / Main Features

The Samsung SGH-F400 is a dual slider music phone featuring Bang & Olufsen audio enhancements and conventional 3.5mm audio jack. Like other handsets in their "lifestyle line of feature phones, the F400 carries a very unique and prominent design theme. The top slide exposes a rather large and handsome speaker grill hinting at its audio strength and quality. In fact, Samsung's marketing material proclaims that users should ""live loud" with this music mobile phone.

Looking under the surface, the F400 is a single band (2100MHz) UMTS/HSDPA and Quad band GSM/EDGE handset. This arrangement of network compatiblies likely suggests it is designed for a specific regional rather than a truly global handset. The F400 has a 2.2 inch color screen with 240 x 320 resolution with dual cameras (3MP primary with LED flash and a CIF imager for video conferencing). A rotary scroll wheel and 4 physical buttons round out the user controls in this mid-tier handset. There are 20MB of user accessible memory but most users will need to rely on the external storage of microSD media to carry around their digital music library.

Samsung SGH-F400 Mobile Phone Main Image

Mainstream mobile phone consumers with an orientation towards music functionalities

Released

Per press releases, first release in select markets on April 2008.

Samsung SGH-F400 Mobile Phone - Main PCB Top

Availability

- The Samsung SGH-F400 is available in select world markets such as Europe and Asia.

Volume Estimations

For the purposes of this teardown analysis, we have assumed a lifetime production volume of 2M units.

As a reminder, teardown volume production assumptions are primarily used for our cost analysis in terms of amortized NRE and tooling costs, especially for custom components specific to the model being analyzed (mechanical components especially). Unless assumed, volumes increment by an order of magnitude. Minor changes in volume (say 1 million vs. 2) rarely have a large net effect on our final analysis.

Samsung SGH-F400 Mobile Phone - Main PCB Bottom

As part of iSuppli's Design Forecast Tool (DFT), we forecast handset shipments by major design feature and manufacture, as well as the number of design starts a manufacturer will have by feature set.

iSuppli estimates unit shipments of 168 million HSDPA handsets in 2008 global market. We further estimate 40 million units of 5 megapixel camera phones to ship in the 2008 global market. All estimates are based on a 2 year product life span assumption with an overall global market share of 14% for Samsung.

Main Cost Drivers Representing ~76% of total material cost

Qualcomm - MSM6280 - Baseband Processor - Single Chip, Quad-Band GSM/GPRS, GPS, UMTS, HSDPA up to 7.2Mbps & Bluetooth, 65nm

Primary Camera Module Value Line Item - 3.1MP CMOS, 1/4' Format, Auto Focus Lens

Display Module Value Line Item - 2.2' Diagonal, 262K Color TFT, 240 x 320 Pixels

Samsung Electro-Mechanics - 10-Layer - FR4/RCF HDI, 2+6+2, Lead-Free, Halogen-Free

Toshiba Semiconductor - TY9000A80000GG - MCP - 1Gb NAND Flash + 512Mb Mobile SDRAM

MicroSD Memory Card - 1GB, w/ SD Adapter in Plastic Case

Battery - Li-Ion, 3.7V, 960mAh (Estimated)

Qualcomm - RTR6280 - RF Transceiver - ZIF, Quad-Band GSM/GPRS Transceiver and Tri-Band UMTS Transmitter

Broadcom - BCM2048SKUFBG - Bluetooth / FM Radio - Single Chip, V2.0+EDR, w/ FM+RDS Radio Receiver

Skyworks - SKY77519 - Transmit Module - PAM, Quad Band GSM/GPRS/EDGE, w/ Integrated Antenna Switch

Qualcomm - PM6658 - Power Management IC w/ Integrated USB Transceiver

ATADES10UBE - Charger - 5V, 0.7A

Secondary Camera Module Value Line Item - CIF CMOS, 1/10' Format, Fixed Lens

Enclosure, Main, Top - Injection Molded Polycarbonate, Silkscreened, Metallic Silver Painted, ESD/EMI Coating, w/ 4 Brass Threaded Inserts

Fairchild Semiconductor - FSUSB31L8X - USB 2.0 Switch - DPDT (Qty:6)

Loudspeaker - Ringer, w/ Integral Foam Rubber Gasket & Nylon Mesh Windscreen (Qty:2)

Enclosure, Display, Top - Injection Molded Polycarbonate, Metallic Silver Paint, w/ 4 Brass Threaded Inserts

Enclosure, Display, Bottom - Die-Cast Magnesium, Black Painted, ESD/EMI Coating

Handsfree Accessory - Control - Microphone, w/ Single Button Control and Plastic Clip & Tag

Keypad Assembly - Injection Molded Plastic Keys, Silkscreened, Silver Painted, on Silicone Rubber Substrate

3-Layer - Rigid/Flex Hybrid, FR4/Kapton 2+1, Lead-Free

Material and Manufacturing $116.87

Samsung SGH-F400 Mobile Phone Cost Analysis

The total materials and manufacturing costs reported in this analysis reflect ONLY the direct materials cost (from component vendors and assorted EMS providers), AND manufacturing with basic test. Not included in this analysis are costs above and beyond the material manufacture of the core device itself - cost of intellectual property, royalties and licensing fees (those not already included into the per component price), software, software loading and test, shipping, logistics marketing and other channel costs including not only EMS provider and the OEM's margin, but that of other resellers. Our cost analysis is meant to focus on those costs incurred in the manufacture of the core device and exceptionally in some circumstances the packaging and literature as well.

Manufacturing Notes

OEM/ODM/EMS Relationships / Manufacturing

According to iSuppli's ""Global OEM Manufacturing and Design Analysis - Mobile Handsets Q1 2008", Samsung is traditionally an all in-house manufacturing operation. Only recently has Samsung begun to partner with Foxconn as an EMS partner which registers barely 0.2% of their overall manufacturing capacity. Within the scope of Samsung's internal manufacturing capability, about 70% of their products are made in Korea and 30% are made in lower cost countries such as China and India.

Samsung SGH-F400 Mobile Phone - Enclosure Disassembly

Country of Origin / Volume Assumptions

Based on markings, the unit was assembled in Korea. Furthermore, we have assumed that custom mechanicals (plastics, metals, etc.) were also sourced in Korea.

Country of origin assumptions relate directly to the associated cost of manufacturing, where calculated by iSuppli. In the cases of 'finished' sub-assemblies (such as display module), we do not calculate internal manufacturing costs, but rather assess the market price of the finished product in which case country of origin assumptions may or may not have a direct effect on pricing.

Remember also that labor rates are applied directly only to hand inserted components and systems in our bill of materials, and although regional assumptions do, these new rates do not have a direct effect on our modeled calculations of placement costs for automated SMD assembly lines. ""Auto" inserted components (such as SMT components) placement costs are calculated by an iSuppli algorithm which allocates a cost per component based on the size and pin-count of the device. This calculation is affected by country or region of origin as well.

Design for Manufacturing / Device Complexity

The Samsung SGH-F400 has an overall component count of 701 components (excluding box contents), of which, 172 are mechanical in nature. The SGH-F400 represents our median point in this comparative study of 5 music handsets. As a comparison, the previously analyzed 3.5G Samsung slider, SGH-U900 (Soul) had a component count of 782. This slight increase can be accounted by the secondary display / control in the SGH-U900. In general, slider handsets present more complexity to an otherwise mature handset complexity

Component counts have a direct bearing on the overall manufacturing cycle times and costs, and also can increase or decrease overall yields and re-work. Our calculations of manufacturing costs factor counts and more qualitative complexities in the design. The cost of manufacturing is also, to some extent, decreased in this case because of assumed labor rate applied for Korea.

Note that manual labor has a much smaller effect on auto-insertion assembly lines (for the Main PCB, for example), where manufacturing costs are much more capital equipment intensive and driven by these investment costs.

Design Notes

Overall, the SGH-F400 is typical of past feature phone designs featuring Qualcomm basebands from Samsung. The core Qualcomm MSM6280 is a familiar DBB solution previously seen on a high end handset. Other Qualcomm contributions to the F400 design are the power management IC with integrated USB transceiver and the companion RTR6280 RF transceiver.

Here is a summary of the major components used in the Samsung SGH-F400 design:

Main PCB

Baseband

• Baseband Processor - Qualcomm - MSM6280

Memory

• MCP - Toshiba Semiconductor - TY9000A80000GG

Battery / Power Management

• Power Management IC w/ Integrated USB Transceiver - Qualcomm - PM6658

User Interface

• Bluetooth / FM Radio - Broadcom - BCM2048SKUFBG
• Image Processor - Mtekvision - MV9317
• Audio Power Amplifier - Samsung Semiconductor - S5M0065X01

RF Transceiver

• RF Transceiver - Qualcomm - RTR6280 ZIF

PA

• Transmit Module - Skyworks - SKY77519
• PAM - RF Micro Devices - RF3266

Camera

• 3.1MP CMOS, 1/4' Format, Auto Focus Lens

Display

• 2.2' Diagonal, 262K Color TFT, 240 x 320 Pixels

"

Samsung SGH-F400 Mobile Phone - Box Contents