Acquired Electronics360

Mobile Devices

Siemens S55 Mobile Phone Teardown

30 August 2004
The following is an overview of a teardown analysis conducted by IHS Technology Teardown Services.

Siemens S55 Mobile Phone - Main ImageSiemens S55 Mobile Phone - Main Image

The Siemens S55 is a compact candy-bar style phone with a basic feature set that puts it in the mid-level of the market. With a complement of useful functions but lacking in features common to higher end phones (such as built-in camera, high-res display, etc.), the S55 packs more than an average basic phone into a smaller-than-average package.

This phone shares many of the core circuit components with other Siemens models, such as the Infineon PMB7850 single-chip baseband processor IC and the Htachi RF Transceiver. Siemens has developed a solid and proven core platform for most of their products based on these building blocks.

Siemens S55 Mobile Phone - Main Cost DriversSiemens S55 Mobile Phone - Main Cost Drivers

Powered by CR4, the Engineering Community

Discussion – 0 comments

By posting a comment you confirm that you have read and accept our Posting Rules and Terms of Use.
Engineering Newsletter Signup
Get the Engineering360
Stay up to date on:
Features the top stories, latest news, charts, insights and more on the end-to-end electronics value chain.
Weekly Newsletter
Get news, research, and analysis
on the Electronics industry in your
inbox every week - for FREE
Sign up for our FREE eNewsletter


Date Event Location
12-16 Aug 2018 Vancouver, Canada
11-13 Sep 2018 Novi, Michigan
27 Sep 2018 The Reef, Los Angeles
03-05 Oct 2018 Boston, Massachusetts
26 Oct 2018 Old Billingsgate
Find Free Electronics Datasheets