Data comm and interconnect vendor Molex has completed its acquisition of Smiths Interconnect, a subsidiary of Smiths Group plc in the U.K.
The deal will bring semiconductor test capabilities and a portfolio of ruggedized custom connectors, contacts, RF components and optical transceivers for harsh environments. The electronic components will complement data communications and data center solutions from Molex to support growth in AI.
The acquisition is Molex’s largest in its history and will help drive innovation in a range of markets like:
- Aerospace and defense
- Space exploration
- Industrial
- Medica
- Semiconductor test
“This acquisition reinforces Molex’s position as a leader across every sector where high reliability is critical,” said Michael Cole, SVP and president, Aerospace and Defense Solutions Division at Molex. “By unifying these high-reliability solutions under the Molex banner, we provide a borderless platform that enables engineers to leverage ruggedized, precision-engineered connectivity.”
Additionally, the deal will expand Molex’s footprint to more than 90 plants across 22 countries and increase its headcount to more than 55,000 employees.
