Acquired Electronics360

Aerospace

Spindle Screw Pump Provides High Performance, Reliability for Liquid Cooling Systems

24 May 2016

Laird has developed a spindle screw pump that delivers consistent and reliable performance in liquid cooling systems. Compared to centrifugal pumps, Laird’s spindle screw technology can pump fluids of higher viscosity without losing flow rate, and pressure changes have little effect on pump performance. This is vital in high G-force applications, such as a rotating gantry system used in a CT scanner, as the pump is able to maintain constant flow and pressure while under high G-force stress.

Laird’s three-screw pump is composed of a single rotor element that is powered, while two others are idle. Spindle screw pumps move fluid axially without turbulence, eliminating foaming that would otherwise occur in viscous fluids. The idle rotors are rotated by liquid pressure, essentially generating a fluid bearing, or hydrodynamic film, that provides radial support similar to journal bearings.

The self-priming spindle screw pumps allow an independent, flexible positioning within the liquid cooling system. Respective to the cost of ownership, the value of a highly reliable spindle screw pump is through long lifetime operation that can span several years with minimal to no maintenance. This minimizes down time by eliminating the need to turn off the end-user system for pump replacement.


The pump head and motor are combined into one waterproof housing unit and can push either oil or water coolant. The fluid is pushed uniformly with the rotation of the spindles along the axis and is forced out the other end, which reduces power consumption and increases efficiency. In addition, pressure changes have little effect on spindle screw pumps, making them ideal for a range of applications.



Powered by CR4, the Engineering Community

Discussion – 0 comments

By posting a comment you confirm that you have read and accept our Posting Rules and Terms of Use.
Engineering Newsletter Signup
Get the Engineering360
Stay up to date on:
Features the top stories, latest news, charts, insights and more on the end-to-end electronics value chain.
Advertisement
Weekly Newsletter
Get news, research, and analysis
on the Electronics industry in your
inbox every week - for FREE
Sign up for our FREE eNewsletter
Advertisement

CALENDAR OF EVENTS

Date Event Location
30 Nov-01 Dec 2017 Helsinki, Finland
23-27 Apr 2018 Oklahoma City, Oklahoma
18-22 Jun 2018 Honolulu, Hawaii
Find Free Electronics Datasheets
Advertisement