Sanyo SCP7050 Mobile Phone Teardown

Main Features / Overview

The Sanyo SCP-7050 is a rugged barebones CDMA clamshell phone that resembles earlier Motorola models that compete in the same space. Sanyo focuses their marketing materials on the rugged nature of the device (dust resistance, shock and vibration, etc. per Mil Std 810F), and clearly has a supporting feature set to respond to this market.

The device comes with embedded GPS, and links with a service known as TeleNav that lets users track where the phone is at all times via the web - useful for companies with multiple users in the field, either service companies, or delivery services, etc.

As for the phone itself - it's a clamshell dual-band CDMA phone, with dual displays (color primary, monochrome secondary), loudspeaker for handsfree use, push-to-talk (Sprint Ready Link), Bluetooth V1.1, and even web browsing (WAP 2.0 browser). But the Sanyo SCP-7050, in the spirit of being an industrial workhorse phone lacks any frills such as media playback, cameras, etc.

Sanyo SCP7050 Mobile Phone Main Image

Industrial users are clearly the target market - truck drivers, taxis, delivery vehicles, construction workers, etc. leveraging features such as online GPS tracking of phones, remote security, call limits and blocking remotely, etc.

Released

Per March 27, 2007 per press release - The SCP-7050 by Sanyo will be available beginning in early April through Sprint retail channels including www.Sprint.com.

Sanyo SCP7050 Mobile Phone - Main PCB Top

Per press release - Suggested retail price is $149.99 with a two-year subscriber agreement.

Volume Estimations

For the purposes of this teardown, we estimate unit shipments for the Sanyo SCP-7050 over the course of a 2-year production lifetime would be on an order of magnitude around 900K units.

As a reminder, volume production assumptions are not meant to be necessarily 'market accurate', but are meant primarily to be used for our cost analysis in terms of amortized NRE and tooling costs, especially for custom components specific to the model being analyzed (mechanical components especially).

ISuppli's Design Forecast Tool (DFT) and Market Shares

As part of iSuppli's Design Forecast Tool (DFT), we forecast handset shipments by major design feature and manufacture, as well as the number of design starts a manufacturer will have by feature set.

From our Design Forecast Tool (DFT), we estimate total shipments of 55 million dual-band CDMA 1xRTT handsets to ship in the 2007 global market.

Function / Performance

No testing was performed on this unit.

Sanyo SCP7050 Mobile Phone Cost Analysis

Main Cost Drivers Representing ~64% of total materials cost as follows :

Qualcomm - MSM6125 - Baseband Processor - Single Chip, CDMA2000 1X , GSM/GPRS, GPS & Bluetooth - (Qty:1)

Display Module (Primary)- 2.0' Diagonal, 65K TFT, 240 x 320 Pixels - (Qty:1)

Toshiba Semiconductor - TY90009800E0GG - MCP - 64MB NAND Flash , 64MB Mobile SDRAM - (Qty:1)

NEC - 68866-Y06 - ASIC - Power Management IC - (Qty:1)

SCP-22LBPS - Battery - Li-Ion, 3.7V, 1000 mAh - (Qty:1)

CMK - Main PCB - 8-Layer - FR4/RCF HDI, 3+2+3, Lead-Free - (Qty:1)

Qualcomm - RFR6500 - RF Receiver - ZIF, Dual-Band CDMA2000 1X, 800/1900MHz, GPS - (Qty:1)

Bluetooth Radio - Contains Broadcom BCM2004 Bluetooth Radio V1.2 for Qualcomm Chipset - (Qty:1)

Qualcomm - RFT6150 - RF Transmitter - Dual-Band CDMA2000 1X, 800/1900MHz - (Qty:1)

Display Module (Secondary) - 1.0' Diagonal, Monochrome, 64 x 96 Pixels - (Qty:1)

Materials and Manufacturing ~$82.22

What Is Not Included in our Cost Analysis

The total materials and manufacturing costs reported in this analysis reflect ONLY the direct materials cost (from component vendors and assorted EMS providers), AND manufacturing with basic test. Not included in this analysis are costs above and beyond the material manufacture of the core device itself - cost of intellectual property, royalties and licensing fees (those not already included into the per component price), software, software loading and test, shipping, logistics marketing and other channel costs including not only EMS provider and the OEM's margin, but that of other resellers. Our cost analysis is meant to focus on those costs incurred in the manufacture of the core device and exceptionally in some circumstances the packaging and literature as well.

Manufacturing Notes

Country of Origin / EMS provider

This product was labeled with China as the country of origin. Furthermore, we have assumed that for this model, that PCB was also populated in China and that custom mechanicals (plastics and metals) were also sourced domestically.

Country of origin assumptions relate directly to the associated cost of manufacturing, where calculated by iSuppli. In the cases of 'finished' sub-assemblies (such as Bluetooth modules or camera modules), we do not calculate internal manufacturing costs, but rather assess the market price of the finished product in which case country of origin assumptions may or may not have a direct effect on pricing.

Remember also that labor rates are applied directly only to hand inserted components and systems in our bill of materials, and although regional assumptions do, these new rates do not have a direct effect on our modeled calculations of placement costs for automated SMD assembly lines. "Auto inserted components (such as SMT components) placement costs are calculated by an iSuppli algorithm which allocates a cost per component based on the size and pincount of the device. This calculation is affected by country or region of origin as well.

Sanyo SCP7050 Mobile Phone - Enclosure Disassembly

Design for Manufacturing / Device Complexity

Clamshell phones typically are usually electronically more complex and mechanically more complex, because of the 'split' nature of the design. Such phones require more parts including more interconnect devices, but also more discrete mechanical enclosures, hinges, etc. and generally requires a larger number of discrete assemblies which increases not only manufacturing cycle times, but increases costs such due to the increased cost of managing more discrete assemblies, their manufacturing and inventory management for discrete pieces and assemblies.

Overall, the Sanyo SCP-7050 has a total component count of 752 components, of which 128 are mechanical in nature. This puts the Sanyo within the norms clamshell design complexity and component count.

The number of mechanical components usually is a direct driver of hand-assembly costs, whereas the electronic component count (and I/O count, density, etc.) are relative metrics for the more automated portion (namely SMT assembly) of manufacturing costs.

Component counts have a direct bearing on the overall manufacturing cycle times and costs, and also can increase or decrease overall yields and re-work. Our calculations of manufacturing costs factor counts and more qualitative complexities in the design. The cost of manufacturing is also, to some extent, decreased in this case because of assumed labor rate applied for China.

Note that manual labor has a much smaller effect on auto-insertion assembly lines (for the Main PCB, for example), where manufacturing costs are much more capital equipment intensive and driven by these investment costs.

Design Notes

This is a very basic and well-integrated design that revolves around Qualcomm's MSM6125 (Multimedia Platform) chip from Qualcomm. Oddly, a Qualcomm power management solution was NOT applied (a rarity), but rather an NEC chip. In all other phones seen to date, Qualcomm typically is the provider of the main chip accompanying power management device. Almost all major functionality is in the Qualcomm chip including GPS functionality, and Bluetooth baseband functionality. Oddly, most of the other Qualcomm-based phones we see, still have separate Bluetooth (mostly likely because of the V1.1 limitation) and rarely actually take advantage of Qualcomm's integrated GPS functionality.

Overall, in summary, this is a well-integrated design with a very finite number major discrete components.

Main PCB

Baseband

• Qualcomm - MSM6125 - Single Chip, CDMA2000 1X , GSM/GPRS, GPS & Bluetooth

Battery / Power Management

• NEC - ASIC -Power Management Chip (Rare to see non-Qualcomm solution in this slot)

Memory

• MCP - Toshiba Semiconductor - TY90009800E0GG - 256Mb NOR, 64Mb PSRAM

RF/PA

• RF Transmitter - Qualcomm - RFT6150 - Dual-Band CDMA2000 1X
• RF Receiver - Qualcomm - RFR6500 - ZIF, CDMA2000 1X
• Power Amplifier - Anadigics - AWT6137RM7P8 - CDMA2000 1X, 824-849 MHz
• Power Amplifier - Anadigics - AWT6308R - CDMA2000 1X, 1850-1910 MHz

User Interface

• No major IC's - Bluetooth integrated in Baseband

Display Modules

• Primary - 2.0' Diagonal, 65K Color TFT, 240 x 320 Pixels
• Secondary - 1.0' Diagonal, Monochrome, 64 x 96 Pixels

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Sanyo SCP7050 Mobile Phone - Box Contents