Overview / Main Features
The Apple MacBook Pro under analysis here is one of 3 trims of MacBook Pro featuring 13.3 LED backlit display, 2.26GHz Intel Core 2 Duo processor, Nvidia 9400M chipset, 160GB hard disk drive and 2 GB of DDR3 memory. The market differentiator for the MacBook Pro is in its unique physical design. The entire Apple MacBook Pro line of laptop computers features unibody chassis construction. Essentially, the aluminum enclosure is milled from one unitary block of aluminum as opposed to traditional methods of laptop enclosure construction which required multiple pieces of plastics and metals. This radical approach significantly reduces the overall component count but relies heavily on precision and quality manufacturing. The 13-inch MacBook Pro comes standard with 160GB hard drive a slot loading 8x DVD+/-RW drive. Other design features of note are the glass multi-touch trackpad, on board SD memory card reader and a 60Wh internal battery capable of providing up to 7 hours of power.
Mainstream Laptop Consumer
Per press releases, this specific model of the MacBook Pro was introduced Mid 2009.
Pricing - Based on the configuration of the device under analysis, the Apple MacBook Pro retails for $1199 directly from Apple.com.
Availability - assumed global (availability details on store.apple.com)
For the purposes of this teardown analysis, we have assumed a lifetime production volume of 1M units.
As a reminder, teardown volume production assumptions are primarily used for our cost analysis in terms of amortized NRE and tooling costs, especially for custom components specific to the model being analyzed (mechanical components especially). Unless assumed, volumes increment by an order of magnitude. Minor changes in volume (say 1 million vs. 2) rarely have a large net effect on our final analysis.
Main Cost Drivers Representing ~80% of total materials cost
Intel - P7550 - CPU - Intel Core 2 Duo Processor P7550, 2.26GHz, 3MB L2 Cache, 1066MHz FSB, 45nm
AU Optronics - B133EW07 - Display Module Value Line Item - 13.3'Diagonal, Color TFT, 1280 x 800 Pixels, LED Backlight
A1322 - Battery Pack - Li-Ion Polymer, 10.95V, 5480mAh, 60Wh
Nvidia - MCP79MXT-B3 - Chipset - GeForce 9400M G, 55nm
Samsung Semiconductor - M471B2873EH1-CF8 - SODIMM DDR3-1066 - 1GB, 128Mx64 (Qty:2)
Hitachi-LG Data Storage - GS23N - CD/DVD RW Drive - Slim Internal Type, Slot Load, 8X DVD±R/RW, DVD±R DL, 24X/10X/24X CD-R/RW/ROM
Fujitsu - MJA2160BH - Hard Drive - 160GB, 2.5', SATA 3Gb/s, 5400 rpm, 8MB Buffer
Enclosure, Main, Top - Machined Aluminum, Anodized, 2-Pieces, 4 Spot-Welded Joints, 1 Stand Off, Printed
Broadcom - BCM94322USA - WLAN Module Value Line Item - IEEE802.11a/b/g/n
Nan Ya PCB Corp. - 12-Layer - FR4, Lead Free, Halogen Free
Samsung Electro-Mechanics - A1184 - AC Adapter - Input: 100-240V 50/60Hz 1.5A, Output: 16.5V, 3.65A, 60W, w/ Clear Plastic Sleeve & Magsafe Connector & Plastic Connector Cap
Total BOM Cost $560.35
What Is Not Included in our Cost Analysis
The total materials and manufacturing costs reported in this analysis reflect ONLY the direct materials cost (from component vendors and assorted EMS providers), AND manufacturing with basic test. Not included in this analysis are costs above and beyond the material manufacture of the core device itself - cost of intellectual property, royalties and licensing fees (those not already included into the per component price), software, software loading and test, shipping, logistics marketing and other channel costs including not only EMS provider and the OEM's margin, but that of other resellers. Our cost analysis is meant to focus on those costs incurred in the manufacture of the core device and exceptionally in some circumstances the packaging and literature as well.
OEM/ODM/EMS Relationships / Manufacturing
Apple outsources 100% of their manufacturing to ODM/EMS partners in the far-east. According to the latest iSuppli's "Global OEM Manufacturing and Design Analysis - Compute Platforms, Apple's mobile PC manufacturing partners are split between Quanta, Hon Hai (Foxconn) and Pegatron (Asustek) in approximately 55%, 31% and 14% loadings respectively.
Country of Origin / Volume Assumptions
Based on markings, the unit was assembled in China. Furthermore, we have assumed that custom mechanicals (plastics, metals, etc. were sourced in China.
Country of origin assumptions relate directly to the associated cost of manufacturing, where calculated by iSuppli. In the cases of 'finished' sub-assemblies (such as LCD display), we do not calculate internal manufacturing costs, but rather assess the market price of the finished product in which case country of origin assumptions may or may not have a direct effect on pricing.
Remember also that labor rates are applied directly only to hand inserted components and systems in our bill of materials, and although regional assumptions do, these new rates do not have a direct effect on our modeled calculations of placement costs for automated SMD assembly lines. ""Auto" inserted components (such as SMT components) placement costs are calculated by an iSuppli algorithm which allocates a cost per component based on the size and pincount of the device. This calculation is affected by country or region of origin as well.
Design for Manufacturing / Device Complexity
The Apple MacBook Pro has an overall component count of 1867 (excluding box contents), of which, 420 are mechanical in nature. This complexity metric is on par with most notebook computer platforms we have encountered in the past with the exception of fewer mechanical parts due to the unibody construction.
Component counts have a direct bearing on the overall manufacturing cycle times and costs, and also can increase or decrease overall yields and re-work. Our calculations of manufacturing costs factor counts and more qualitative complexities in the design. The cost of manufacturing is also, to some extent, decreased in this case because of assumed labor rate applied for China.
Note that manual labor has a much smaller effect on auto-insertion assembly lines (for the Main PCB, for example), where manufacturing costs are much more capital equipment intensive and driven by these investment costs.
The most significant design feature in the Apple MacBook Pro is its all-aluminum unibody construction. The unibody enclosure design not only gives the MacBook Pro a very high structural rigidity but reduces the number of parts of the main enclosure. The unibody construction is indeed a ground breaking manufacturing technology but one that requires significant manufacturing and tooling investments by Apple.
Other significant designs to note -
Just as with all recent mobile platforms introduced by Apple, the MacBook Pro comes standard with Nvidia's 9400M GPU/Chipset. Apple continues to differentiate from other laptop computer manufacturers by sticking to their own motherboard designs rather than to take a reference design from Intel which relies on bundling of Intel chipsets.
Likewise, Apple has taken a custom design approach to the trackpad by using a Broadcom multitouch controller and propriety software. Whereas mainstream PC manufacturer would likely package a solution provide by Synaptics or Cypress, Apple has full ownership of the design and implementation of this user interface function.
Here is a summary of the major components used in the Apple MacBook Pro design:
- Intel - P7550 - Core 2 Duo Processor, 2.26GHz, 3MB L2 Cache, 1066MHz FSB, 45nm
- Nvidia - MCP79MXT-B3 - GeForce 9400M G, 55nm
- SODIMM Module - Samsung Semiconductor - M471B2873EH1-CF8 (DDR3-1066 - 1GB, 128Mx64, Quantity 2)
I/O & Interface
- MCU - Renesas - R4F2117LP (16 Bit, H8S/2600 CPU Core, 160KB ROM, 8KB RAM, 20MHz, 3.0 - 3.6V, 112 I/Os)
- IEEE1394 Host Controller - LSI Logic - L-FW643E-01-DB (Integrated 1394b-2002 OHCI PHY/Link-Layer, PCI Express)
- Mixed Signal Array w/ On Chip Controller - Cypress Semiconductor - CY8C24794-24LFXI (Programmable SoC, 16K Flash, 1K RAM)
- Audio Codec - Cirrus Logic - CS4206ACNZ
- SD Card Reader Controller - Genesys Logic - GL137A-MN
- Ethernet Transceiver - Realtek - RTL8251CA (10/100/1000Base-T)
- USB Peripheral Controller - Cypress Semiconductor - CY7C63833-LFXC (8-Bit, V2.0 Compliant)
- AU Optronics - B133EW07 - 13.3'Diagonal, Color TFT, 1280 x 800 Pixels, LED Backlight
- Hard Drive - Fujitsu - MJA2160BH (160GB, 2.5', SATA 3Gb/s, 5400 rpm, 8MB Buffer)
- CD/DVD RW Drive - Hitachi-LG Data Storage - GS23N (Slim Internal Type, Slot Load, 8X DVD±R/RW, DVD±R DL, 24X/10X/24X CD-R/RW/ROM)
- Broadcom - BCM94322USA - IEEE802.11a/b/g/n
- Broadcom - BCM92046MD_MNI - V2.1+EDR
- Multitouch Controller - Broadcom - BCM5974C (Capacitive, 0.13um)