Nokia 6555 Mobile Phone Teardown

Overview / Main Features

The Nokia 6555 is a mid-range flip phone that aspires to be an 'elegant' fashion accessory phone. The Nokia 6555, at its core, is a 3G phone based on Nokia's "RAP3GS baseband (TI, also used in Nokia N93), and, in addition features GPS, Bluetooth 2.0, a 1.3 MP camera, and a 2 inch 240x320 pixel primary display with 16 million colors.

The main standout feature of this phone for us would have to be the GPS feature, because despite a lot of hype about GPS in phones, we have yet to see many (any?) phones with this feature actually implemented. This is because we have seen many phones featuring Qualcomm chipsets that technically have GPS capabilities, but they are not actually implemented in the design. Secondly, this phone actually uses a standalone chip (TI) for dedicated, discrete GPS functionality. The future of GPS is phone integration, and Nokia seems to be committed to getting GPS functionality in handsets as soon.

Higher-end consumer mainstream based on aesthetics and marketing statements, however based on specs and pricing alone this is a mid-range phone.

Per Nokia's press release: ""Mobile-savvy consumers expect superior quality and design. We understood that need, and so created the Nokia 6555. The Nokia 6555 is a sophisticated accessory…"

Released

Per Nokia's press release (August 21, 2007): : ""The Nokia 6555 will be available within the next month", (Sept 2007).

Pricing and Availability

Per Nokia's press release: ""The Nokia 6555 will be available…at an estimated retail price of approximately EUR 200 before subsidies or taxes.".

Volume Estimations

For the purposes of this teardown analysis, we have assumed a lifetime production volume of 3 million units.

As a reminder, teardown volume production assumptions are primarily used for our cost analysis in terms of amortized NRE and tooling costs, especially for custom components specific to the model being analyzed (mechanical components especially). Unless assumed volumes are different by an order of magnitude, minor changes in volume (say 1 million vs. 2) rarely have a large net effect on our final analysis because of this.

ISuppli's Design Forecast Tool (DFT) and Market Shares

ISuppli estimates unit shipments estimate of 149 million units of WCDMA handsets in the 2007 global market with further estimates of unit shipments of 388 million 1 Mpx camera phones in 2007 global market by Nokia.

Function / Performance

Functional testing was not performed on the Nokia 6555.

Nokia 6555 Mobile Phone Cost Analysis

Nokia 6555 Mobile Phone Cost Analysis

Main Cost Drivers Representing ~65% of total materials cost

Display Module - 2.0' Diagonal, 16M Color TFT, 240 x 320 Pixels - (Qty:1)

Texas Instruments - NMP #4377239 (RAP3GS V2.0E) - DBB - Digital Baseband Processor - (Qty:1)

Samsung Semiconductor - K5G1257ATM-DF75 - MCP - 512Mb NAND Flash + 256Mb Mobile SDRAM, PoP - (Qty:1)

Display Module (Secondary) - 1.3' Diagonal, 128 x 160 Pixels, 262K Color TFT - (Qty:1)

Camera Module - 1.3MP CMOS, 1/5' Format - Fixed Lens - (Qty:1)

Texas Instruments - GPS5300 - GPS - Single Chip, A-GPS, NaviLink 4.0 - (Qty:1)

ST Microelectronics - NMP #4380206 - RF Transceiver - Quad-Band GSM/GPRS/EDGE, WCDMA 850/1900 - (Qty:1)

Ibiden Beijing - Main PCB - 8-Layer - FR4/RCF HDI, 1+6+1 - (Qty:1)

ST Microelectronics - NMP #4376535 - Power Management IC - (Qty:1)

ST Microelectronics - NMP #4396299 - ABB - Analog Baseband / Power Management - (Qty:1)

RF Micro Devices - NMP #4355951 - Transmit Module - PAM, w/ Integrated Antenna Switch, Quad-Band, GSM/EDGE 850/900/1800/1900 - (Qty:1)

ST Microelectronics - STV0984N - Video / Image Processor - 2 MegaPixel, SMIA Compliant CMOS Sensors, 0.13um - (Qty:1)

CSR - BC41B143A - BlueCore4ROM - Single Chip Bluetooth Solution, V2.0+EDR - (Qty:1)

Interconnect - 4 Layer Flex Kapton, w/ Two 60-Pin Board to Board Plugs on Flex Kapton Substrate, w/ Metal Stiffener - (Qty:1)

RF Micro Devices - NMP #4355898 - PAM - WCDMA 850/1900MHz - (Qty:1)

Materials & Manufacturing $98.13

What Is Not Included in our Cost Analysis

The total materials and manufacturing costs reported in this analysis reflect ONLY the direct materials cost (from component vendors and assorted EMS providers), AND manufacturing with basic test. Not included in this analysis are costs above and beyond the material manufacture of the core device itself - cost of intellectual property, royalties and licensing fees (those not already included into the per component price), software, software loading and test, shipping, logistics marketing and other channel costs including not only EMS provider and the OEM's margin, but that of other resellers. Our cost analysis is meant to focus on those costs incurred in the manufacture of the core device and exceptionally in some circumstances the packaging and literature as well.

Manufacturing Notes

Nokia Relationships / Manufacturing

We do not currently know, down to the model, where specific models may be manufactured, or by what EMS/ODM. The only information we have for these teardown analyses is typically limited to what is noted (except for handset country of origin labeling which are still used as the driving assumptions for manufacturing costs).

Having said all of this about relationships - Nokia are assumed to be performing almost all of their own manufacturing work in house at one of 10 plants placed worldwide (about 75%), and furthermore, we estimate that approximately 80% or more of all production takes places in low-cost Nokia facilities, with the remainder in mid and high-cost countries. Major external partners included Elcoteq, Jabil and Foxconn (as of 2005).

Country of Origin / Volume Assumptions

Based on markings, the unit was assembled in Korea. However, we have assumed that custom mechanicals (plastics, metals, etc.) as well as PCBA population were performed at in lower cost regions - specifically mainland China.

Country of origin assumptions relate directly to the associated cost of manufacturing, where calculated by iSuppli. In the cases of 'finished' sub-assemblies (such as Bluetooth modules or camera modules), we do not calculate internal manufacturing costs, but rather assess the market price of the finished product in which case country of origin assumptions may or may not have a direct effect on pricing.

Remember also that labor rates are applied directly only to hand inserted components and systems in our bill of materials, and although regional assumptions do, these new rates do not have a direct effect on our modeled calculations of placement costs for automated SMD assembly lines. ""Auto" inserted components (such as SMT components) placement costs are calculated by an iSuppli algorithm which allocates a cost per component based on the size and pincount of the device. This calculation is affected by country or region of origin as well.

Design for Manufacturing / Device Complexity

Nokias, as a general rule, have fewer discrete mechanical and electronic components, for the same amount of functionality than their competitors. Furthermore, Nokia have a very modular approach to designs which make them simpler to manufacture, improving production cycle times and ease of re-work.

Furthermore, the Nokia 6555 (not including box contents) has a total component count of 546 components, of which 83 are mechanical components. Overall this puts this Nokia 6555 well within the norms, even the 'low-end' of clamshell phone component counts, even by Nokia standards (Nokia tends to always be at the lower end of the spectrum of component counts and manufacturing complexity when compared with all other manufacturers).

The number of mechanical components usually is a direct driver of hand-assembly costs, whereas the electronic component count (and I/O count, density, etc.) are relative metrics for the more automated portion (namely SMT assembly) of manufacturing costs.

Component counts have a direct bearing on the overall manufacturing cycle times and costs, and also can increase or decrease overall yields and re-work. Our calculations of manufacturing costs factor counts and more qualitative complexities in the design. The cost of manufacturing is also, to some extent, decreased in this case because of assumed labor rate applied for China.

Note that manual labor has a much smaller effect on auto-insertion assembly lines (for the Main PCB, for example), where manufacturing costs are much more capital equipment intensive and driven by these investment costs.

Nokia 6555 Mobile Phone - Enclosure Disassembly

Design Notes

Here is a summary of the major components used in the Nokia 6555 design:

Main PCB

Baseband

• DBB / Apps Processor - (OMAP) - Texas Instruments - RAP3GS_V2.0-PA - RAP3GS
• (Note package-on-package memory listed below)

Baseband - Battery / Power Management

• Power Management IC - ST Microelectronics -4376535 - BETTY-V2.1-V2.2-LF - Micro USB Drivers, LED Drivers

Memory

• Samsung Semiconductor - K5G1257ATM-DF75 - MCP (512Mb NOR Flash + 256Mb DDR DRAM ) - P-o-P
• (This package on package is actually mounted directly on the DBB/Apps Processor)

RF Transceiver - Power Amplifier

• RF Transceiver - ST Microelectronics - AHNEUS204A - Quad-Band GSM/GPRS/EDGE + WCDMA
• PAM (GSM) - RF Micro Devices - RF9283 - Quad-Band, GSM850/EGSM900/DCS1800/PCS1900
• PAM (WCDMA) - RF Micro Devices - RF3278 - WCDMA 850/1900MHz

User Interface

• Bluetooth - CSR - BC41B143A - BlueCore4ROM - Single Chip Bluetooth Solution, V2.0+EDR
• ""AVILMA" - ST Microelectronics - 4396299 - ABB - Analog Baseband / Power Management - SIM Card Interface / Audio
• GPS - Texas Instruments - GPS5300 - Single Chip, A-GPS, NaviLink 4.0
• Video / Image Processor - ST Microelectronics - STV0984N - 2 MegaPixel, SMIA Compliant CMOS Sensors, 0.13um

Camera Module

• Module - Manufacturer Unknown
• Image sensor - Samsung - S5K5A1FX - 1.3 MP, CMOS, 1/5' Format - 2.25 um x 2.25 um Pixel Size, 2.88mm x 2.16mm Active Image Area

Display Modules

• Primary - 2' Diagonal, 16M Color TFT, 240 x 320 Pixels
• Secondary - 1.3" Diagonal, 262K Color TFT, 128x160 Pixels

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Nokia 6555 Mobile Phone - Box Contents