Overview / Main Features
The Option iCON 505 is an USB based wireless boardband module that is designed for use on a UMTS/GSM networks. At the core of the dual-band HSPA and quad-band GPRS/EDGE modem is a design from Icera based on their Livanto chipset, which includes the ICE8040 baseband processor, ICE8215 RF transceiver and ICE8145 power management chip. Memory solution is provided by a Samsung multi-chip package featuring 1Gb of NAND flash and 256Mb mobile SDRAM.
Wireless Broadband Service Providers
Pricing - Unknown, typically USB wireless modems do not have published pricing as they are sold (through contracts to service providers)
Availability - Assumed global
For the purposes of this teardown analysis, we have applied a lifetime production volume of approximately 4M units.
As a reminder, teardown volume production assumptions are primarily used for our cost analysis in terms of amortized NRE and tooling costs, especially for custom components specific to the model being analyzed (mechanical components especially). Unless assumed volumes are different by an order of magnitude, minor changes in volume (say 1 million vs. 2) rarely have a large net effect on our final analysis because of this.
Main Cost Drivers ~80% of Total Materials Cost
Icera - ICE8040 - Baseband Processor - Quad-Band GSM/EDGE, WCDMA/HSPA, HSDPA 7.2Mbps, HSUPA 5.76Mbps, 1GHz, 65nm
Samsung Semiconductor - K521F57ACM-A060 - MCP - 1Gb NAND Flash + 256Mb Mobile SDRAM (Estimated)
Icera - ICE8215 - RF Transceiver - Quad-Band GSM/EDGE, Tri-Band WCDMA/HSPA, 130nm RF CMOS
Icera - ICE8145 - Power Management IC - w/ Dual DC to DC Converters, 11 LDOs, USB Transceiver
Skyworks - SKY77344-11 - PAM - Quad-Band GSM/EDGE
Epcos - B30674D5017Q824 - FEM - Quad-Band GSM, Tri-Band UMTS Antenna Switch, & 2 Epcos Dual Band GSM RX RF SAW Filters
8-Layer - FR4/RCF HDI, 2+4+2, Lead-Free
Anadigics - AWT6224RM28 - PAM - Dual-Band WCDMA/HSDPA 900/2100
Enpirion - EN5322QI-T - Regulator - DC-DC Converter, Synchronous Buck, PWM, 2A, 2%
Rohm - Tantalum - Encapsulated (Qty:16)
Kyocera - KT2520 Series - TCXO - 19.200MHz
Direct Materials + Manufacturing $24.25
What Is Not Included in our Cost Analysis
The total materials and manufacturing costs reported in this analysis reflect ONLY the direct materials cost (from component vendors and assorted EMS providers), AND manufacturing with basic test. Not included in this analysis are costs above and beyond the material manufacture of the core device itself - cost of intellectual property, royalties and licensing fees (those not already included into the per component price), software, software loading and test, shipping, logistics marketing and other channel costs including not only EMS provider and the OEM's margin, but that of other resellers. Our cost analysis is meant to focus on those costs incurred in the manufacture of the core device and exceptionally in some circumstances the packaging and literature as well.
Country of Origin / Volume Assumptions
Based on markings, the unit was likely assembled in Ireland. Furthermore, we have assumed that custom mechanicals (plastics, metals, etc.) were also sourced in Ireland.
Country of origin assumptions relate directly to the associated cost of manufacturing, where calculated by iSuppli. In the cases of 'finished' sub-assemblies (such as internal antennas), we do not calculate internal manufacturing costs, but rather assess the market price of the finished product in which case country of origin assumptions may or may not have a direct effect on pricing.
Remember also that labor rates are applied directly only to hand inserted components and systems in our bill of materials, and although regional assumptions do, these new rates do not have a direct effect on our modeled calculations of placement costs for automated SMD assembly lines. "Auto inserted components (such as SMT components) placement costs are calculated by an iSuppli algorithm which allocates a cost per component based on the size and pincount of the device. This calculation is affected by country or region of origin as well.
Design for Manufacturing / Device Complexity
The Option iCON 505 USB Modem has an overall component count of 355.
Component counts have a direct bearing on the overall manufacturing cycle times and costs, and also can increase or decrease overall yields and re-work. Our calculations of manufacturing costs factor counts and more qualitative complexities in the design. The cost of manufacturing is also, to some extent, decreased in this case because of assumed labor rate applied for Ireland.
Note that manual labor has a much smaller effect on auto-insertion assembly lines (for the Main PCB, for example), where manufacturing costs are much more capital equipment intensive and driven by these investment costs.
Here is a summary of the major components used in the Option iCON 505 USB Modem design:
- Baseband Processor - Icera - ICE8040
- Power Management IC - Icera - ICE8145
RF / PA
- RF Transceiver - Icera - ICE8215
- MCP - Samsung Semiconductor - K521F57ACM-A060, 1Gb NAND Flash + 256Mb Mobile SDRAM (Estimated)