Multimedia

Next generation COM Express compact computer-on-module

03 December 2020

The new low-power high-density Tiger Lake SoCs offer significantly greater CPU performance and nearly three times higher GPU performance along with state-of-the-art PCIe Gen4 and USB4 support. congatec’s COM Express computer-on-modules will accelerate many performance hungry fanless edge applications in harsh industrial and embedded environments. Typical new edge computing tasks include industrial and tactile IoT, machine vision and situational awareness, real-time control and collaborative robotics, as well as real-time edge analytics and artificial intelligence (AI) with inference workloads enabled to run across all four new CPU cores, or on up to 96 graphics execution units of the brand new Intel Iris Xe graphics.

For demanding IoT applications like collaborative robotics, autonomous vehicles, AI or contactless retail markets, congatec’s 11th Gen Intel Core processor based modules take advantage of the ‘total compute’ capabilities of the CPU and GPU. In combination with Intel Time Coordinated Computing technologies, extensive virtualization and in-band error correction, these new platforms help minimize jitter and are ideal to meet the demands of critical real-time computing applications.

The feature set in detail

conga-TC570 COM Express compact module is available with new scalable 11th Gen Intel Core processors. Support PCIe x4 in Gen 4 performance to connect peripherals with massive bandwidth. In addition, designers can leverage 8x PCIe Gen 3.0 x1 lanes. COM Express module offers 4x USB 3.2 Gen 2 and 8x USB 2.0 in compliance to the PICMG specification. Modules execute 1x GbE for networking, supporting TSN. Comprehensive board support packages are provided for all leading RTOS’s, including hypervisor support from Real-Time Systems as well as Linux, Windows and Chrome.



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