Designed for versatility

TE Connectivity's (TE) new 1.0 mm centerline locking High Performance Interconnect (HPI) solution addresses the needs of low-profile applications that require a reliable, secure wire-to-board signal or low-power connection. A locking feature strengthens the mating connection between the plug assembly and the receptacle and provides an audible and tactile click feedback when mating. Our broad portfolio is available in right angle and vertical PCB mounting orientation, position sizes ranging from 3-15 and gold and tin plating options.

New 1.0 mm centerline locking High Performance Interconnect (HPI) solutions provide:

• Reliable, secure connection
  • Locking feature strengthens mating connection between the plug assembly and the receptacle
  • Audible and tactile click feedback when mating
  • Helps alleviate accidental unmating from pulling
• Proven performance and reliability
  • Can reach up to 1 A power
  • Gold plating options available to protect against erosion in harsh environment applications