NXP announced it is collaborating with Changan Automobile and Neusoft to establish the China Auto Security Common Interests Group (CIG). The group brings together a hardware-based industry cooperative organization for automotive security with local automotive and software partners in the global market. CIG will adopt “NXP 4 plus 1 security framework”— reportedly the highest level of car information security today.
In another announcement, NXP and Xiaomi Inc. said they are successfully deploying best-in-class technologies to implement secure and convenient mobile transit experiences countrywide across China’s popular metro stations and public bus lines. Since the initial launch of the mobile transit services in June, activation rates grew more than 15% in Shanghai and more than 20% in Shenzhen among commuters. And with Xiaomi’s recent launch of Mi Pay, featuring NXP’s embedded secure element technology, consumers will benefit from the highest level of security for transactions from both bank and transportation accounts.
NXP is also collaborating with Midea to achieve R&D innovations in Smart kitchen appliances. NXP has brought changes to Midea products through technological innovations: the semiconductor-heating cube demonstrated at the Technology Forum is the first result of this cooperation. The semiconductor heating cube features the MHT1004N solution based on NXP’s RF technology and is small in volume, lightweight and easy to carry, offering users a more convenient cooking experience.
NXP has also expanded its MagniV microcontrollers product line and introduced a broad portfolio of hardware, software and integrated motor- control solutions designed to dramatically speed time to market. The new integrated solution would simplify system development and shorten design cycles.