Semiconductor Equipment

Vorago to move its chip manufacturing to SkyWater foundry

25 January 2023

Vorago Technologies has effectively moved its fabrication efforts to SkyWater’s foundry in a collaboration that will implement Vorago’s patented Hardsil technology.

As part of the agreement, the Hardsil technology — which is a semiconductor processing method to enable devices to operate at high temperature and radiation levels — will be available to SkyWater customers as a design-enabled processing method for new or existing designs.

This process does not impact any die size or specification and does not require redesign. SkyWater said the semiconductor processing technology will enhance its 90 nm complementary metal-oxide-semiconductor (CMOS) process for commercial use in space, aviation, industrial and medical applications that need high levels of radiation tolerance.

Radiation hardened electronic components must be designed and manufactured so that exposure to ionizing radiation and extreme temperatures does not cause catastrophic failure. The Vorago technology meets rad-hard performance without requiring design changes, SkyWater said.

SkyWater said that as part of the U.S.’s recent moves to strengthen domestic semiconductor manufacturing capabilities such as the passage of the CHIPS and Science Act, this collaboration will position SkyWater to source important national security components for use in the aerospace and defense applications.

To contact the author of this article, email engineering360editors@globalspec.com


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