Industrial Electronics

Rohde & Schwarz to host Digital Debug Design challenge at DesignCon 2023

23 January 2023

At DesignCon 2023, Rohde & Schwarz will showcase live demos covering the latest industry trends and invites attendees to test their knowledge at the interactive “Are you a genius?” Digital Debug Design challenge.

This year at DesignCon 2023, Rohde & Schwarz is bringing a new way to experience and demonstrate solutions for high-speed digital applications. At the company’s booth (#1049), attendees can put their design knowledge to the test with the Rohde & Schwarz Digital Debug Design challenge. The challenge takes place in 30-minute intervals during the DesignCon exhibit hours and will incorporate a series of lab challenges that evaluate attendee’s measurement skills in signal integrity, power integrity and electromagnetic interference debug.

High speed digital solutions are available for demonstration at DesignCon 2023. Source: Rohde & SchwarzHigh speed digital solutions are available for demonstration at DesignCon 2023. Source: Rohde & Schwarz

In addition to the Digital Debug Design challenge, Rohde & Schwarz will be highlighting multiple demonstrations at the company’s booth. These include a 112 Gbps PAM4 copper channel analysis using the R&S ZNA high-end vector network analyzer (VNA). Another setup will feature the R&S ZNB VNA performing multilane compliance automation using R&S ZNrun VNA automation suite. And the R&S FSWP phase noise analyzer will be carrying out jitter and phase noise measurements.

Rohde & Schwarz will exhibit at DesignCon in booth 1049 at Santa Clara, California, Convention Center on February 1 through February 2, 2023. Open to all trade show attendees, Rohde & Schwarz is sponsoring a day of complimentary technical seminars hosted by Rohde & Schwarz specialists and industry experts. Beginning at 8 AM on February 1 in the Great America Meeting Room 2, the technical seminars will cover topics such as 112 Gbps PAM4 front panel connectivity, mastering phase noise/jitter measurements, far-end crosstalk in high-speed PCB channels and more.

Attendees interested in the technical seminars can register in advance on the Rohde & Schwarz DesignCon workshop landing page. For those unable to attend DesignCon 2023, all technical seminars will be available online following the event.

To contact the author of this article, email engineering360editors@globalspec.com


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