Electronics and Semiconductors

Nexperia to demonstrate automotive and industrial applications at Electronica 2022

15 November 2022

Semiconductor developer Nexperia will showcase its offering for automotive and industrial applications at Electronica 2022 (November 15-18) in Munich, Germany, in booth C3-319.

“After years of virtual meetings, we look forward to meeting our customers in person in Munich,” said Mark Roeloffzen, SVP and general manager business group bipolar discretes. “Electronica showcases the complete range of technologies, products and solutions across the entire industry and will highlight the ubiquity of Nexperia’s essential semiconductors. If it has a battery, plug or motor, you can be sure to find one of our diodes, bipolar transistors, ESD protection devices, metal-oxide semiconductor field-effect transistors (MOSFETs), gallium arsenide (GaN) field-effect transistors (FETs) or analog and logic ICs.”

Electronica 2022 provides an ideal opportunity to engage with customers and focus on current industry megatrends such as connectivity, digitalization, electrification, automation, sustainability and energy efficiency. Nexperia will demonstrate how its ongoing commitment to investment in R&D and capacity is supporting these megatrends with its expanding portfolio, which is capable of delivering complex, high-power products at volume to support power management and signal conversion.

Nexperia will also be showing a selection of demo boards that illustrate the company’s power capabilities. Among the products and technologies to be featured will be:

  • CCPAK Nexperia’s new surface-mount copper-clip package for power GaN
  • GaN FETs double pulse evaluation board
  • Nexperia’s evaluation board for benchmarking dynamic performance of 650 V silicon carbide rectifiers
  • Power management ICs, including a battery booster, for wireless sensors and internet of things applications powered by coin cells
  • Nexperia’s first gate driver IC for power switching applications
To contact the author of this article, email engineering360editors@globalspec.com

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