Industrial Electronics

Smallest mezzanine modules with the power of a Zynq UltraScale+ MPSoC for I/O processing and programmable logic

20 May 2022

Acromag’s new APZU series expands their offering of mini PCIe-based AcroPack mezzanine modules with a programmable I/O solution featuring the Xilinx Zynq UltraScale+ multiprocessor system-on-a-chip (MPSoC). Three models are available, offering a choice of digital I/O interfaces; 28 transistor-transistor logic (TTL), 20 TTL and 3 RS422/485, or 14 low-voltage differential signaling (LVDS) signals. These mezzanine modules mount on a variety of AcroPack carrier cards for PCIe, VPX and other platforms. This allows developers to mix and match I/O combinations on one board for embedded applications running on Linux, Windows, or VxWorks operating systems.

The APZU’s Zynq 3CG MPSoC combines a feature-rich ARM-based processing system and programmable Source: AcromagSource: Acromaglogic in a single device. Two dual-core ARM Cortex CPUs (A53 application processor and R5 real-time processor) deliver high-performance computation capability. 154k logic cells provide plenty of field-programmable gate array (FPGA) processing blocks for hardware acceleration and compute-intensive tasks. Additional resources include large on-chip memory, external memory interfaces, and a rich set of peripheral connectivity interfaces. Gigabit Ethernet, USB 2.0 and USB-UART interfaces are supported.

AcroPack modules are just 30 mm x 70 mm. They use a standard mini PCIe edge connector; a down-facing, 100-pin connector is added. This internally routes I/O signals through the carrier card to secure field connectors; thus eliminating loose cables and increasing reliability.

The APZU modules are ideal for adaptive filtering, protocol conversion, simulation, hardware-in-the-loop (HIL) test, motor control, image processing and sensor fusion applications. Additionally, the COTS modules can be used in PCIe servers, VPX or CompactPCI serial chassis, and small form factor embedded computers.

To contact the author of this article, email engineering360editors@globalspec.com


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