Mobile Devices

Smartphone shipments to rebound in 2022

19 November 2021

Smartphone shipments have had a bumpy 2021.

For the first half of the year, the smartphone market was booming with double-digit growth, but in the third quarter things took a dramatic turn with a drop in shipments by 6.7%.

But things are expected to improve in 2022 with marginal growth next year expected, assuming economic activities worldwide return to normal post-COVID, according to new data from TrendForce.

The market research firm expects annual smartphone production for 2022 to reach about 1.39 billion units, growing 3.8% year-over-year. The driver will be the usual device replacement cycle as well as increased demand from emerging markets.

Among the major players:

  • Samsung is forecast to reach 276 million units, growing 1.1% YoY.
  • Apple with its latest iPhone lineup will reach 243 million units, growing 5.4% YoY.
  • With increased demand likely in China, the three major domestic brands Oppo, Xiaomi and Vivo will depend on overseas sales for market share growth. Of these three, Xiaomi is expected to benefit most with a production forecast of 220 million units, growing 15.8% YoY.
  • Oppo will produce 208 million units, growing 2.5% YoY.
  • Vivo will produce 150 million handsets, growing 6.4% YoY.

The push for 5G

The Chinese government is actively pushing for 5G commercialization and leads all regions in 2021 with 5G smartphone shipments. Moving forward, this won’t change with market shares of 5G smartphones surpassing 80% in China, TrendForce said.

Because of this, the semiconductor industry will likely shift its focus of 5G development to other regional markets, but because the progress of 5G infrastructure varies by region, 5G growth may slow down in 2022 outside of China, the market research firm said.

TrendForce forecasts 5G smartphone production to reach 660 million units in 2022, a market share of 47.5% in the overall smartphone market.

Learn more about TrendForce’s data with its Semiconductor Research.

To contact the author of this article, email PBrown@globalspec.com


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