Semiconductor Equipment

Kopin’s imagers to be included in Goepel’s semiconductor test equipment

17 June 2020

The spatial light modulators (SLMs) from Kopin Corp. and the light emitting diode (LED) drivers from Kopin’s subsidiary Forth Dimension Displays Limited (ForthDD) will be integrated into Goepel Electronic’s 3D automated optical inspection (AOI) and 3D solder paste inspection (SPI) products.

Goepel is a German-based inline inspection equipment manufacturer for surface mount technology (SMT) production lines.

The 3D SPI measures solder paste in three dimensions on PCBs in real time, allowing for improved yields and product quality while reducing waste and cost, Kopin said. The SLM projects light onto the PCB being inspected by the 3D SPI machine and the soldering quality of assembled PCBs are inspected using the 3D AOI by a similar process.

ForthDD’s microdisplay using a ferroelectric liquid crystal is a fast switching, all digital, reflective SLM product designed for inline 3D inspection applications.

To contact the author of this article, email engineering360editors@globalspec.com


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