Industrial Electronics

New Tepro thick-film heat sink device provides non-inductive, high heat dissipation

12 June 2020

New Yorker Electronics is now distributing a heat sink device with enhanced power size ratio, high stability and optimum heat dissipation.

The new Tepro TO-220 non-inductive, thick-film heat sink resistor in the TO-20 type is designed for switching power supplies and various types of pulse circuits. Tepro manufactures precision and power resistors for the military and commercial applications.Source: New Yorker ElectronicsSource: New Yorker Electronics

Tepro has been designing and manufacturing both wirewound resistors and metal film resistors for their chassis mount resistor, power resistor and surface mount resistor lines for over 50 years. The Tepro TO-220 is a miniature device that features a plated copper heat sink, a high stability thick-film element and tinned copper leads. It also has high temperature thermoset molding.

Custom models are available with variations in lead length, tolerance to 0.5% and temperature coefficients. It is terminal strength tested at a 5 lb pull and its solderability and solvent resistance meet MIL-STD-202 requirements. Many of Tepro’s precision and power resistors are custom designed and have the ability to meet very tight tolerances and even tighter lead times — including custom magnetics, microwave, resistors and wound film capacitors.

To contact the author of this article, email engineering360editors@globalspec.com


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