Motor Control and Switchgear

ETEL’s new Z3TM: Four degrees of freedom

08 April 2020

A new standalone motion platform from ETEL provides a surface with four degrees of freedom in a stacked architecture and is an alternative to piezoelectric solutions. It is designed in response to the needs of advanced wafer positioning in the semiconductor industry while also being useful as a standalone product in a variety of Source: ETELSource: ETELindustries such as medical, pharmaceutical and general inspection.

The Z3TM platform uses a combination of three flexures and a rotary module to deliver rotary, Z-axis and two oblique axis motions to a plate that can be anchored to a supporting table for multiaxial motion solutions. The product compactness establishes a large density in terms of number of functions per volume.

The motion platform allows for migration from piezoelectric solutions, eliminating their hysteresis problems while supporting nanometer level resolution, accuracy and repeatability at even higher dynamics. Users can achieve improved navigation accuracy in the XY plane as well as along the Z direction by means of mapping tables. Pre-programmed accuracy conditions and real-time compensations driven by external sensors allow for a reduced focus time, therefore increasing throughput and improving the cost of ownership.

The Z3TM stems from ETEL’s continuous innovation and vertical integration. Characteristics include an infinitely rotating theta axis, tip/tilt correction over ±0.08° for leveling and for move and settle improvement, radial runout of ±3.5 µm and a maintenance free Z-axis, all at an ISO class 2 clean room compatibility.

If required as part of the application development, customizations can be implemented that include, but are not limited to, higher IP ratings, extended rated payload, the addition of pneumatic actuators for lift pin ring or similar mechanisms, and additional vacuum and signal lines.

ETEL S.A. is based in Switzerland with exclusive North American distribution through Heidenhain Corporation in Schaumburg, Illinois.

To contact the author of this article, email engineering360editors@globalspec.com


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