Discrete and Process Automation

Video: Advantech Industrial-IoT World Partner Conference on co-creating the IIoT ecosystem

10 December 2019

Advantech, a developer of internet of things (IoT) technology, held a two-day Industrial-IoT World Partner Conference (IIoT WPC) at the company's IoT Campus in Linkou, Taiwan. It was the first large-scale partner conference since the IoT Co-Creation Summit held in Suzhou last year. This year, Advantech shared its Source: AdvantechSource: Advantechinsights and perspectives on how to confront industrial IoT (IIoT) challenges in the future through the theme of Driving Digital Transformation in Industrial IoT. Also, Advantech invited Dr. Deepu Talla, vice president and general manager of Intelligent Machines, NVIDIA; and Erik Josefsson, vice president and head of Advanced Technology, Ericsson, to share their perspectives on AI, 5G and edge computing.

To confront the dilemma of fragmentation in the IIoT application space, Advantech developed an industrial app platform to resolve this challenge. Through the utilization of WISE-PaaS IIoT platform functions, Advantech provides microservices that allow Domain-Focused Solution Integrator (DFSI) partners to have easy access to all the featured modules so they can collaborate with Advantech and develop complete industrial solutions. According to Linda Tsai, president of IIoT Business Group, Advantech, “To accelerate the process of resolving the fragmentation dilemma and realizing the goal of co-creation, the strategy for Advantech IIoT Business Group in 2020 has three major directions: Advancing product technology in order to connect with the leading trends that aim at targeted industrial markets; perfecting the implementation and operation of WISE-PaaS Marketplace 2.0, and strengthening partner relationships and exchange of co-creation ideas.”

  • Advancing product technology in order to connect with the leading trends that aim at targeted industrial markets: Targeting specific IIoT industries such as Industry 4.0 infrastructure, smart manufacturing, traffic environment monitoring, and energy, Advantech IIoT provides a whole series of edge-to-cloud products with leading technologies, ranging from 5G to AI applications. The goal is to provide optimal business support for digital transformation, corresponding with trending developments.
  • Perfecting the implementation and operation of WISE-PaaS Marketplace 2.0: WISE-PaaS Marketplace 2.0 is a trading platform for IIoT solutions that provide customers with subscription services for industrial apps (I.App). The platform invites its ecosystem partners to launch their solutions via the platform. Users are able to subscribe Edge.SRP, General I.App, Domain I.App, AI modules, as well as consulting services, and training services provided by Advantech and partners on WISE-PaaS Marketplace 2.0.
  • Strengthen partner relationship bonding and exchange of co-creation ideas: Deepen the connections and relationships with channel partners, system integrators, and DFSI, to build a future of co-existence as ecosystem partners through the exchange and sharing of ideas, and co-creation collaboration.

Breakthroughs and growth in key technology development industrial AI, intelligent edge computing and industrial communication

At the WPC, Advantech also showcased breakthroughs and growth in the development of technologies in various key sectors such as Industry 4.0 infrastructure, smart manufacturing, traffic environment monitoring and energy. These include complete solutions in industrial AI and an exclusive industrial one-stop training collaboration and deployment between Advantech and its partners, designed to help customers quickly and accurately build AI models. The new XNavi series intelligent edge computing software for machine vision inspection, production traceability, equipment monitoring and predictive maintenance was on view, as well as the emphasis on Time-Sensitive Networking (TSN) switches in smart communication, which significantly reduces transmission delays and improves network response speeds.

To contact the author of this article, email engineering360editors@globalspec.com


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