Phononic has announced general availability of Reeftec, its proprietary non-hermetic compatible thermoelectric cooler (TEC) platform. Phononic said its non-hermetic compatible thermoelectric cooler platform is re-engineered from the ground up to provide high reliability and best-in-class cooling performance for non-hermetic laser packaging.
Phononic developed this platform throughout 2018 while working in partnership with leading optical components manufacturers on their cooled, non-hermetic transmitter optical subassembly (TOSA) development programs.
Designed for the demanding and ever-changing thermal needs of optical communications equipment, Phononic’s non-hermetic TEC platform has been recognized as an honoree in the 2019 Lightwave Innovation Reviews program.
“Cooled, non-hermetic laser packages represent a vast opportunity to fundamentally change the trade-offs between cost and performance in optical transceivers,” said Vladimir Kozlov, founder and CEO of LightCounting. “Packaging technologies like chip-on-board and photonic integration will achieve unprecedented cost per bit for next-generation optical components.”
Presented annually by Lightwave, the Lightwave Innovation Reviews program distinguishes top products and solutions available within the optical networking industry as determined by a stellar panel of third-party judges. The Innovation Reviews are judged based on the following six criteria: originality, innovation, positive impact on the customer, how well it addresses a new or existing requirement, novelty of approach and cost-effectiveness.