Electronics and Semiconductors

Rutronik to Focus on Product Application Demonstrations, and Technical and Supply Chain Issues at Electronica 2018

30 October 2018

Rutronik Inc., a global broad-line stocking distributor of a comprehensive range of electronic components, semiconductors, and products and technology solutions for the internet of things and embedded systems, is attending and exhibiting at Electronica 2018. Rutronik will showcase a series of product application demonstrations, and also focus on technical and supply chain issues, including the current state of passive components, security, Industry 4.0 and battery management.

Rutronik’s exhibit at the world’s leading trade fair and conference for electronics will span from Tuesday, November 13 to Friday, November 16, in Munich, Germany, and will include two booth locations. Hall C3-312 will feature the distributor’s partners who will be presenting their latest innovations in individual “supplier lounges." At Hall C4-434, field applications engineers (FAEs) from Rutronik’s Rutronik24 e-commerce platform will showcase product demonstrations from its four vertical segments, which include automotive, embedded, power and smart, at 16 counters.
The product demos at Hall C4 — Booth 434 will address future topics, such as predictive maintenance, robotics and battery management. FAEs will be available at the booth to advise customers and explain the exhibited projects in more detail.
Automotive
• High-voltage heater from Webasto
• AC charging station from Webasto
• Laser demo by Osram
• Connectors for automotive use from Molex
Embedded
• Artificial intelligence demo by Intel
• Security demo by Swissbit
• Industrial TFTs from URT
• Passive matrix OLEDs from Raystar
• EfusG1C demo by F&S
Power
• Standard capacitors versus polymer hybrid capacitors: demo by Panasonic
• Robotics demo by Infineon
• Spin motor control from ST
• Battery management system demo by Rutronik in cooperation with several manufacturers
Smart
• Rotary switch solutions from Infineon, Melexis and TDK Micronas
• Predictive maintenance technologies from multiple manufacturers
• Sensor-to-cloud demo by Telit, Intel and Tianma
• Security solutions for industrial automation

To contact the author of this article, email engineering360editors@globalspec.com


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