Semiconductors and Components

Presto Engineering Offers Specialized Testing Service for CMOS Image Sensors up to 12-in. Diameter

08 March 2018

Testing complementary metal-oxide-semiconductor (CMOS) image sensors on a wafer-size scale is not easy because of the challenges inherent in creating uniform Source: Presto Engineering, Inc.Source: Presto Engineering, Inc.illumination over a large area. Presto Engineering has developed a custom, computer-controlled solution that illuminates sections of the wafer in turn. Integrating the results enables the whole wafer to be tested automatically for an array of large sensors or even sensors that are right up to the size of an entire 12-inch wafer.

Commercial testing of small image sensors is very easy as the small areas involved are easy to illuminate with a controlled, uniform test pattern of light. But, as the area increases, it becomes harder to maintain the uniformity across the test area of an individual sensor due to the limitation of the optics. By illuminating sections of the wafer in turn, Presto is able to merge the results together to test the functionality of the image sensors on the wafer.

The need for larger image sensors is being driven, in particular, by medical imaging and aerospace applications that require whole wafer-sized image sensors and are transitioning from charge-coupled devices to CMOS solutions. Similarly, security and military applications demand larger, high-performing sensors to provide the resolution required to provide clear sharp images, as well as other 4K resolution cameras. The tester is located in Presto's EAL 5/6+ facilities so that it meets the security needs of sensitive applications.

Presto's Teradyne® IP750Ex based test solution provides a large (80-by-100 millimeter), uniform (+/-2 percent) and high-intensity illumination field up to 10K Lux at a range of color temperatures. Built-in IR filtering prevents sensor damage. Its ability creates a customized test solution for complex devices (as large as 32M pixels at speeds up to 200 megahertz) on up to 12-inch wafers and enables fast ramps without compromising cost-of-test.

Presto Engineering will be attending the conference at Image Sensors Europe 2018 on March 14 and 15.

More information about Presto Engineering can be found at

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