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    HEADLINES ARCHIVE

  • As One ARM Pioneer Closes Another One Opens

    A comparison of the situations of Calxeda Inc. and Rex Computing shows that relying on startup silicon to attack new markets could be a weakness.

  • XMOS Replaces Founding CTO with Icera Alumnus

    Chip designer and entrepreneur replaces parallel processing academic as chief technology officer at event-driven microcontroller company in preparation for next phase of development.

  • ARM Support Claimed for Non-filamentary ReRAM

    An innovative non-volatile resistive memory called CeRAM, for correlated-electron random access memory, has attracted the interest of processor company ARM, according to the developer, a professor at the University of Colorado.

  • DRAM Stockpiles Not Expected to Rise This Year—An Industry Positive

    In a rousing sign of the market’s continuing health, inventories of dynamic random access memory (DRAM) won’t see an uptick anytime soon in 2014. The index measuring...

  • ARM Licenses MRAM From Crocus

    Processor licensor ARM licenses MRAM technologies from research lab spin-off Crocus Technology to aid the development of security and microcontroller chips.

  • IBM Makes Most Advanced Graphene IC

    IBM Researchers have reported on a RF receiver IC fabricated with graphene field effect transistors that operates at 4.3-GHz. Made on a silicon CMOS wafer line the circuit highlights the potential for integration with silicon control circuits.

  • AMD Launches 'Seattle' 64-bit ARM Server Processor

    Taking aim at Intel's turf AMD will be sampling its quad- and octa-cored 28nm, 64-bit ARM-based 'Seattle' processor this quarter. The company has exhibited a development platform for it at the Open Compute Summit in San Jose, Calif.

  • Chip Industry Faces Financial Distress

    The green shoots of economic recovery could be masking the fact that the semiconductor industry is becoming less profitable with consolidation a likely consequence during 2014 and beyond, according to business consultancy Alix Partners.

  • FDSOI Gains Design Wins Amid Fab Partner Mystery

    ST has 15 design wins for its FDSOI manufacturing process but volume manufacturing at a second-source foundry has been pushed back to 2015.

  • Industrial Electronics Turns Around in 2013 with Double-Digit Growth

    The global market for industrial electronics semiconductors ended 2013 on an upbeat note, with overall revenue up convincingly from the previous year and reversing the disappointing decline of 2012...

  • ST Reduces Losses But Outlook Remains Weak

    STMicroelectronics is forecasting a decline in its first quarter 2014 sales, partly due to falling away of legacy sales at its now discontinued joint venture ST-Ericsson.

  • Feature Film Focuses on Chip Worker's Death

    The Korean feature film "Another Promise" portrays a father's struggle to prove his daughter death from leukemia was the result of working conditions at a Samsung semiconductor factory south of Seoul.

  • Jobs Cuts Pile Up as Chip Firms Adjust

    Even as the global economy improves chip companies are finding it necessary to lay off workers. For Intel, Renesas and Texas Instruments the idea of "retain, retrain and redeploy" seems to be on the back burner.

  • SMIC Starts Supplying 28nm CMOS

    China's leading domestic foundry has just about joined the 28nm club having run wafers at the end of 2013. The move helps SMIC get closer to rivals such as Globalfoundries and UMC but will also see it need to get more competitive.

  • IMEC Bringing Thermocompression Bonding to 3D ICs

    Research institute is working with local assembly equipment supplier BE Semiconductor Industries (Besi) to bring thermocompression bonding to 3D IC production. That is the same Besi that announced just before the end of 2013 that somebody had stolen money

  • TSMC Tweaks 16nm FinFET to Match Intel

    TSMC maintains capex at about $10 billion and looks to spend on 16nm FinFET production, including a FinFET enhancement. TSMC appears to be taking Intel seriously as foundry competition as the enhancement is reckoned to put TSMC's 16nm process at par with t

  • China’s TV Brands Ordered 6 Percent Fewer LCD TV Panels in 2013

    The holiday-driven surge in orders for liquid-crystal display (LCD) panels from Chinese television brands was not sufficient to offset weakness during the rest of the second half of 2013...

  • Chip Packaging Materials Market to Post Modest Growth

    Declining prices will result in slow growth for semiconductor packaging materials, according to the fab tool vendor trade association SEMI.

  • Dialog Gets Behind Qualcomm's Quick Charge

    Europe's Dialog Semiconductor has announced a pair of chips that support Qualcomm's proprietary Quick Charge technology; results of its acquisition of iWatt Inc. in July 2013.

  • Digital Radiography Makes Major Inroads as A/D Converters Advance

    Just as conventional cameras using film have been demolished by digital photography, the film-based X-ray is going the way of corded phones and dial tones.

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