Acquired Electronics360

Product Watch

Materials

  • Excellent Environmental and Thermal Protection

    Supplier: Henkel Corporation - Electronics
    LOCTITE STYCAST EO 1058 is a single component epoxy system that cures at 125°C. EO1058 provides excellent environmental and thermal protection to encapsulated parts. This product is especially suited for use in protecting devices subjected to harsh environments such as automotive applications.
  • New Sarcon® Thermal Interface Material catalog

    Supplier: Fujipoly® America Corp.
    Engineers say the new layout and added content helps them quickly find a thermal interface material that is best suited for their cooling needs without the added step of calling for technical support. The catalog features thermal interface solutions for virtually any application, ranging from low-cost thin films and form-in-place materials to 17.0 W/m°K high-performance...
  • Epoxylite Hi Temp Epoxy Systems®

    Supplier: ELANTAS PDG, Inc.
    Epoxylite® is the resin system of choice for extremely hot, dirty, corrosive and hostile environments.
  • Henkel’s High Compliance GAP PAD HC 5.0

    Supplier: Henkel Corporation - Electronics
    Henkel’s High Compliance GAP PAD HC 5.0 Provides Excellent Thermal Management Performance for Applications with Increased Power Densities
  • New Temperature stable solder paste

    Supplier: Henkel Corporation - Electronics
    In what is a true market breakthrough, Henkel has developed the first-ever temperature stable solder paste. LOCTITE GC 10 is stable at 26.5 °C for one year and at temperatures of up to 40 °C for one month, providing benefits throughout the logistics and operations chain, while still offering unbeatable printability and reflow performance.
  • The Solder Paste Game Changer

    Supplier: Henkel Corporation - Electronics
    In what is a true market breakthrough, Henkel has developed the first-ever temperature stable solder paste. LOCTITE GC 10 is stable at 26.5 °C for one year and at temperatures of up to 40 °C for one month, providing benefits throughout the logistics and operations chain, while still offering unbeatable printability and reflow performance.
  • Increase Bond Strength with Surface Prep Products

    Supplier: Ellsworth Adhesives
    Surface preparation is key to achieving maximum bond strength when using adhesives and tapes on all types of substrates including metals, plastics, concrete and ceramics, woods and glass.
  • Epoxy for Underfill Applications

    Supplier: Master Bond, Inc.
    Master Bond EP3UF is a one component epoxy that contains thermally conductive fillers with very small particle sizes imparting a low thermal resistance of 5-7 x 10-6 K•m2/W.
  • Protective coatings for electronics design from RS

    Supplier: RS Components, Ltd.
    A new range of protective coatings for electronic production and design is now available from RS Components. The range from MG Chemicals is specifically designed for electronics production and prototyping and includes some of the industry’s best known conductive epoxy resins, conductive greases and conformal coatings, in addition to encapsulating and potting epoxies.
  • 2 component Electrically Conductive Adhesive

    Supplier: Henkel Corporation - Electronics
    LOCTITE ABLESTIK 2902 is a silver-filled, premeasured and packaged two component adhesives used for electronic bonding and sealing applications. It cures at room temperature or by heat and has excellent adhesive to a variety of substrates.
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