Acquired Electronics360

Product Watch


  • Epoxy for Die Attach Applications

    Supplier: Master Bond, Inc.
    Formulated for die attach applications, Master Bond EP17HTDA-1 is a one component epoxy that can also be used for bonding and sealing.
  • Insulate & Protect Your Electrical Assemblies

    Supplier: R. S. Hughes Company, Inc.
    Insulate & Protect Your Electrical Assemblies with 3M Scotchcast Liquid Electrical Resin. Designed to keep your electronic components protected from moisture, impact, and temperature hazards. *For a limited time only get a FREE glove bonus. Simply add any pair of 3M Comfort Grip Gloves to your order and it will automatically adjust to include the gloves for FREE. (Limit on...
  • Fluon compounds for color-coded wire insulation

    Supplier: AGC Chemicals Americas, Inc.
    Fluon melt processable compounds are ideal for color-coded wire insulation, tubing & molded parts.
  • Interface material for heat sink applications

    Supplier: Wacker Chemical Corp.
    Special features - Gap filler, thermal conductivity 2.3 W/mK - Two-part, RT curing - Constant properties from –50 °C to +180 °C - Low stress, soft and tacky - D4-D8 < 350ppm - Low abrasive Application Interface material for heat sink applications for the electronics industry
  • ALPHA® OM-550 Low Temperature Solder Paste

    Supplier: Alpha Assembly Solutions
    Non-Eutectic, Low Temperature, Pin Testable, Solder Paste for Motherboard Assemblies with High Warpage Chips
  • Resources for Building Batteries

    Supplier: Ellsworth Adhesives
    As electronic devices become smaller and more portable, the batteries within these devices must do the same.
  • Use of Aqueous Cleaners and VOC Emission Enforcement

    Supplier: Armakleen Company (The)
    Ask Andy: Use of Aqueous Cleaners and VOC Emission Enforcement Ask Andy: Even though I’m cleaning with an aqueous cleaner, I’ve heard that regulators can come after me for VOC emission enforcement. How can this be?
  • EP39MAOHT: Thermally Conductive Epoxy

    Supplier: Master Bond, Inc.
    Two component, thermally conductive, electrically insulative, room temperature curing epoxy resin system
  • Fujipoly's Sarcon® PG25A

    Supplier: Fujipoly® America Corp.
    Sarcon® PG25A is one of Fujipoly's softest and best performing thermal gap filler pads for applications that have delicate components and high compression rates.
  • Protect Electronics with Thermal Management

    Supplier: Ellsworth Adhesives
    Thermal management is a significant issue when designing electronics for all industries. Luckily, Dow Corning has developed a line of thermal conductive adhesives, encapsulants, dispensable thermal pads and thermally conductive gap fillers that assist in solving these problems in the transportation, aerospace, appliance, medical and consumer electronics markets.