Acquired Electronics360

Product Watch

Materials

  • Toughened, High Performance Encapsulation Compound

    Supplier: Master Bond, Inc.
    Featuring a low viscosity, EP38CL is an optically clear two component epoxy that is used for bonding, sealing, coating and encapsulation in optical, aerospace, opto-electronic and specialty OEM applications. It possesses superior impact resistance, thermal cycling capabilities as well as the ability to withstand mechanical shock better than typical epoxies that are higher on the Shore D...
  • Protect Electronics in Severe Environments

    Supplier: Ellsworth Adhesives
    Silicones are particularly useful in providing protection to electronics and electrical devices. For the most severe environments, Ellsworth Adhesives recommends Dow Corning EE-1010.
  • HydroFlex® XL For Heavy Duty Cleaning

    Supplier: Church & Dwight, Inc. Specialty Products Division
    HydroFlex® XL Heavy duty cleaning, carbon, grease and oil removal, animal, vegetable or petrochemical
  • Dissipate Damaging Heat Effectively

    Supplier: Ellsworth Adhesives
    As electronic devices become smaller, stronger and faster, the need for greater thermal management within these devices has increased exponentially. Ellsworth Adhesives provides a variety of thermally and electronically conductive materials for electronics assembly from Henkel.
  • Bus Bars for Heater Elements

    Supplier: Abrisa Technologies
    Abrisa Technologies is a vertically integrated manufacturer of heater elements and advanced display cover glass with EMI filtering. Value-add capabilities now include ultrasonic soldering of wire leads to screen printed and thin film deposited bus bars on index-matched indium tin oxide (IMITO) and anti-reflective (AR) coated glass.
  • Indium Solder Paste...10.1 Pb-Free

    Supplier: Indium Corporation
    Indium Corporation - 10.1 solder paste enables the lowest cost-of-ownership to PCB assembly manufacturers with an all-around balanced performance for both high print and soldering yields.
  • Ball-Attach Flux

    Supplier: Indium Corporation
    Indium Corporation - The ball-attach process for BGA and PGA packages uses a flux that is usually applied via pin-transfer from a dipping tray. Solder spheres (solder balls) are then placed into the deposits and the whole assembly is reflowed. BGA fluxes are usually water soluble, while PGA fluxes are often very reactive no-clean materials.
  • Thermal Interface Material...Heat-Spring®

    Supplier: Indium Corporation
    Indium Corporation - Many applications call for TIM that can easily be placed on a chip, on a lid or perhaps just against a heat source and a cooling solution contact plate. Indium Corporation developed a metal TIM which would work as a compressible Interface Solution for such an application. Our pressure range is 35psi to 100+ psi.
  • Solder Research Kits for New Product Development

    Supplier: Indium Corporation
    One of the key hurdles in new product development is being able to test a variety of options at a reasonable cost. Indium Corporation's Solder Research Kits provide you with the means to experiment with various solders. Kits available include: Solder Paste Solder Wire Solder Ribbon with fluxes that range from 102°C-350°C.
  • Indium Metal for Soldering and Sealing

    Supplier: Indium Corporation
    No other metal is as versatile as indium metal. In its various forms it is used for: Sealing in cryogenic applications - stays malleable and ductile below -150°C Soldering or fusing applications - alloys melt at temperatures ranging from 6.5°C to 310°C High-end device cooling - reduces operating temperatures by up to 10°C
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