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Product Watch

Materials

  • Indium Solder Paste...10.1 Pb-Free

    Supplier: Indium Corporation
    Indium Corporation - 10.1 solder paste enables the lowest cost-of-ownership to PCB assembly manufacturers with an all-around balanced performance for both high print and soldering yields.
  • Ball-Attach Flux

    Supplier: Indium Corporation
    Indium Corporation - The ball-attach process for BGA and PGA packages uses a flux that is usually applied via pin-transfer from a dipping tray. Solder spheres (solder balls) are then placed into the deposits and the whole assembly is reflowed. BGA fluxes are usually water soluble, while PGA fluxes are often very reactive no-clean materials.
  • Thermal Interface Material...Heat-Spring®

    Supplier: Indium Corporation
    Indium Corporation - Many applications call for TIM that can easily be placed on a chip, on a lid or perhaps just against a heat source and a cooling solution contact plate. Indium Corporation developed a metal TIM which would work as a compressible Interface Solution for such an application. Our pressure range is 35psi to 100+ psi.
  • Solder Research Kits for New Product Development

    Supplier: Indium Corporation
    One of the key hurdles in new product development is being able to test a variety of options at a reasonable cost. Indium Corporation's Solder Research Kits provide you with the means to experiment with various solders. Kits available include: Solder Paste Solder Wire Solder Ribbon with fluxes that range from 102°C-350°C.
  • Indium Metal for Soldering and Sealing

    Supplier: Indium Corporation
    No other metal is as versatile as indium metal. In its various forms it is used for: Sealing in cryogenic applications - stays malleable and ductile below -150°C Soldering or fusing applications - alloys melt at temperatures ranging from 6.5°C to 310°C High-end device cooling - reduces operating temperatures by up to 10°C
  • New Solder Paste.. high Pb-containing applications

    Supplier: Indium Corporation
    Indium Corporation announces a new solder paste technology. BiAgX™ is a high-melting lead-free (Pb-free) solder paste technology designed for high reliability electronics assembly applications. Designed as a drop-in replacement for standard high Pb-containing solder pastes, it has passed MSL1 and thermal cycle testing at several power semi...
  • System Cleaner for Hot Oil Systems

    Supplier: Paratherm — Heat Transfer Fluids
    Paratherm - Stop potential system problems that impact your production. Paratherm hot-oil system cleaners clean your system on the fly safely and easily. Dissolves and suspends carbon lumps and sludge.
  • Flux Coatings-reduce voiding w/Solder Preforms

    Supplier: Indium Corporation
    Indium Corp. - Solder joint voiding is tough to deal with. When attaching components, such as power amplifiers/transistors or QFNs, the larger the footprint the bigger the challenge. For some time now I have been suggesting the use of a preform with flux coating as an approach to help reduce voiding. Logically, if you introduce less flux you entrap less...
  • Soldering Products Meet New Requirments

    Supplier: Indium Corporation
    Indium Corp. Introduces a full line of soldering products that satisfy IPC’s J-STD004B stricter requirements for measuring halogens and electromigration risk. Indium Corporation’s full line of PCB assembly products specifically designed to meet new international standards, which help to improve both first pass yields and long-term reliability.
  • Optoelectronic Ceramic Packaging Solutions

    Supplier: Advanced Technical Ceramics Company
    AdTech Ceramics provides custom ceramic printed circuit boards for optoelectronics applications, including in-house design capabilities and excellent relationships with outside design service firms for custom design needs.
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