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TSMC Plans to Build 3nm Semiconductor Fab in Tainan Science Park

29 September 2017

Taiwan Semiconductor Manufacturing Corp. (TSMC) has plans to build an advanced 3nm fab in Tainan Science Park.

The pure-play foundry is the first to announce investment into advanced 3nm process ahead of its main competition of other foundries as well as semiconductor vendors Samsung and Intel. TSMC did not reveal how much it will invest in the new fab.

TSMC says it selected Tainan Science Park to leverage the company’s existing cluster of fabs that will also benefit its supply chain.

The company has been working to develop other advanced process technologies—7nm and 5nm—with the goal to begin mass production starting next year for 7nm, followed by roll out of 5nm in 2020.

To contact the author of this article, email Peter.Brown@ieeeglobalspec.com


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