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Industrial Electronics

New Development Kit Incorporates FPGA, ASSP and pASSP Products into One Modular Platform

13 September 2017

Source: MouserSource: Mouser

Mouser Electronics, Inc., is now stocking the Embedded Vision Development Kit from Lattice Semiconductor. The development kit is optimized for mobile-influenced system designs in the industrial, consumer and automotive markets that require flexible, low-cost and low-power image-processing architectures.

The Lattice Embedded Vision Development Kit incorporates a mix of Lattice’s FPGA, ASSP and programmable ASSP (pASSP™) products in a single modular platform for developing designs and enabling faster time-to-market. The kit combines a CrossLink™ input board, an ECP5™ processor board and a Sil1136-based HDMI output board.

The CrossLink input board includes dual-camera HD image sensors that support the MIPI CSI-2 interface, eliminating the need for external video sources and providing an optimal platform for applications such as sensor aggregation and interface conversion for image sensors.

The ECP5 base board enables low-power pre- and post-processing and includes support for HD image signal processing. The onboard ECP5 FPGA receives the raw image sensor data from CrossLink and performs fundamental image processing and sends the data to the HDMI output board.

The HDMI output board is configured to output 1080p at 60 frames per second (fps) through the EP5 I²C master interface on the ECP5 base board. The output board receives RGP (8:8:8) data and control signal from ECP5 and converts it to the HDMI format that is displayed on an HDMI monitor.

The Lattice Embedded Vision Development Kit enables engineers to develop industrial display systems for M2M applications and Industry 4.0 implementations, Advanced Driver Assistance Systems (ADAS) and infotainment applications, DSLR cameras, drones, robotics, augmented reality (AR) and virtual reality (VR) systems and medical equipment.

To learn more about this new development kit, visit Mouser.

To contact the author of this article, email Siobhan.Treacy@ieeeglobalspec.com


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