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MEMS and Sensors

Mobile World Congress Interview Series: STMicroelectronics & the Future of MEMS

01 April 2013

STMicroelectronics: New Products and the Competitive Landscape

Electronics360 Editorial Director Bruce Rayner attended this year’s Mobile World Congress in Barcelona, Spain, where he conducted a series of video interviews with company executives and IHS analysts.

This 11-minute interview is a one-on-one with Benedetto Vigna, executive vice president and general manager of the Analog, MEMS & Sensor Group at STMicroelectronics. Considered the “father MEMS,” Vigna is responsible for over 150 of ST’s patents in MEMS technology. The discussion started with a quick overview of the five new products the company was demonstrating in the show. It then moved on to a discussion about the factors responsible for the company’s leadership position in MEMS and the key MEMS technologies areas Vigna sees as driving growth for STMicroelectronics over the next few years.

Here are some other interviews from the show you may want to check out:

Themes at MWC. A roundtable discussion about the major trends at mobile with three senior IHS analysts: Dale Ford, VP of Electronics and Semiconductor Research; Bill Morelli, Associate Director of Machine for Machine and Connected Devices, and Francis Sideco, Senior Director of Consumer Electronics and Communications Technologies.

Samsung’s Ascent. A one-on-one with Steve Mather, senior principle analyst, IHS, where we discuss Samsung and the reason for its ascendency in the mobile market and speculate on how long its run may last.

Display Trends. Analysis of the latest technologies on display at Mobile World Congress from Vinita Jakhanwal, Director, Small & Medium Displays and Technology, Electronics & Media, IHS.

Keep an eye on The Interview as we’ll be posting conversations from MWC with company executives from Fairchild Semiconductor, GT Advanced Technologies, InterDigital, Invensense and Peregrine Semiconductor.



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