Acquired Electronics360

Consumer Electronics

New Prototyping Developer Kit Allows Engineers to Connect to the Google Cloud

08 August 2017

Mouser Electronics is now stocking the BeagleBone Green Wireless IoT Developers Prototyping Kit for the Google Cloud Platform from Seeed Studio. Seeed Studio teamed up with BeagleBoard.org and Google to introduce an internet of things (IoT) prototyping kit that includes a variety of sensors and actuators from Seeed’s modular Grove System that helps engineers design connected solutions quickly.

BeagleBone Green Wireless IoT Developers Prototyping Kit (Image credit: Seeed Studio)BeagleBone Green Wireless IoT Developers Prototyping Kit (Image credit: Seeed Studio)

Seeed Studio’s BeagleBone Green Wireless IoT Developer Prototyping Kit features the open source BeagleBone Green Wireless board, a Grove base cape that attaches to the BeagleBone board and eight plug-and-play Grove modules. The BeagleBone Green Wireless board has 2.4 GHz Wi-Fi 802.11b/g/n and Bluetooth® 4.1 low energy connectivity to allow engineers to connect to Google Cloud Platform. The board provides 512 Mbytes of DDR3 RAM, 4 GBytes of eMMC flash storage, a microSD slot and two PRU 32-bit microcontrollers. It also has a 3D graphics accelerator and NEON floating-point for enhanced multimedia and user experience. The board includes 65 possible digital inputs and outputs (I/Os) from the dual 46-pin headers.

The included Grove base cape includes 12 Grove connectors, two UART, two analog inputs, four I²C and four digital I/O connectors that interface with corresponding pins on the BeagleBone board. The kit provides a range of Grove modules with functions used in many internet-equipped devices, like a 3-axis accelerometer, motion sensor, light sensor and temperature sensor as well as an OLED display.

The BeagleBone Green Wireless ships with Linux and BeagleBoard’s Cloud9 integrated development environment (IDE) on the eMMC. It supports Debian, Ubuntu and other distributions of Linux, Android, and other open source operating systems.

To learn more about this new developer prototyping kit, visit the Mouser site here.

To contact the author of this article, email Siobhan.Treacy@ieeeglobalspec.com


Powered by CR4, the Engineering Community

Discussion – 0 comments

By posting a comment you confirm that you have read and accept our Posting Rules and Terms of Use.
Engineering Newsletter Signup
Get the Engineering360
Stay up to date on:
Features the top stories, latest news, charts, insights and more on the end-to-end electronics value chain.
Advertisement
Weekly Newsletter
Get news, research, and analysis
on the Electronics industry in your
inbox every week - for FREE
Sign up for our FREE eNewsletter
Advertisement

CALENDAR OF EVENTS

Date Event Location
30 Nov-01 Dec 2017 Helsinki, Finland
23-27 Apr 2018 Oklahoma City, Oklahoma
18-22 Jun 2018 Honolulu, Hawaii
Find Free Electronics Datasheets
Advertisement