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Data Center and Critical Infrastructure

Single Package 64-layer 3D Flash Memory SSD Released

03 August 2017

The SSD BG3 series. Image credit: TAECThe SSD BG3 series. Image credit: TAEC

Toshiba America Electronic Components Inc. (TAEC) has introduced a next-generation single-package ball grid array (BGA) solid state drive (SSD) series based on the company’s 64-layer, 3-bit-per cell triple-level cell (TLC) BiCS Flash.

The SSD BG3 series leverages the host memory buffer (HMB) feature in the NVM Express revisions 1.2.1 to maintain high performance without integrated DRAM by using host memory for flash management purposes. The devices are geared toward next-generation mobile platforms that harness the performance of NVMe storage in a small footprint. TAEC says these miniaturized SSDs also offer data center and enterprise applications, an alternative to server boot storage.

The series delivers up to 1,520-megabyte per second sequential read, 2.7 times the theoretical maximum bandwidth of SATA 6 gigabits per second and up to 840-megabyte per second sequential write, 1.5 times the theoretical maximum bandwidth of SATA 6 gigabits per second.

The BG3 is available in 128-gigabyte, 256-gigabyte and 512-gigabyte capacities.

To contact the author of this article, email Peter.Brown@ieeeglobalspec.com


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