Infineon Technologies AG has entered the packaged silicon microphone microelectromechanical systems (MEMS) market with a new family with a 70 dB signal-to-noise ratio (SNR).
Based on Infineon’s dual backplate MEMS technology, the microphones feature a low distortion level of 10 percent at a 135 dB sound pressure level (SPL) and are in a compact package making them suitable for acoustic recordings and far field voice capturing applications.
The dual backplate MEMS technology uses a membrane embedded within two backplates that generates a truly differential signal. This allows for high frequency immunity for better audio signal processing and increases the acoustic overload point of 10 percent total harmonic distortion (THD) to 135 dB SPL, Infineon says.
Engineering samples of the MEMS microphones are slated to begin in the fourth quarter with production quantities available in the first quarter.