Acquired Electronics360

Consumer Electronics

Teardown: Sony PlayStation 4 Pro

29 March 2017
The following is an overview of a teardown analysis conducted by IHS Technology Teardown Services.

In September 2016, Sony Interactive Entertainment (SIE) announced the introduction of PlayStation®4 Pro (PS4®Pro) (CUH-7000 series) computer entertainment system, which delivers enhanced experiences through improved image processing capability and support for 4K quality images.

Playstation 4 Pro Playstation 4 Pro

Summary points:

Based on AMD Jaguar 8-Core, 2.1GHz CPU, 28nm, CXD90044GB

1TB 2.5" HDD & Blu-Ray Optical Drive

8GB GDDR4 SDRAM

HDMI 2.0

Target market: Mass Market

Released: 2016 November

Pricing: $399 USD

Availability: Global

Total cost (direct materials and manufacturing): $317.80

Major Components:

  • CPU, Single Chip, 8-Core AMD Jaguar, w/ AMD Radeon GPU, 28nm - MFG: ADVANCED MICRO DEVICES INC - MPN: CXD90044GB
  • Hard Drive, 1 TB, 2.5", SATA 6Gb/s, 5400RPM, 8MB Buffer - MFG: HGST INC - MPN: HTS541010A9E680
  • SGRAM, GDDR5, 1GB - MFG: SAMSUNG SEMICONDUCTOR INC - MPN: K4G80325FB-HC28
  • Blu-Ray/CD/DVD, Slot Load, Internal, w/ 3 Flat Flex Cables
  • SGRAM, GDDR5, 1GB - MFG: SAMSUNG SEMICONDUCTOR INC - MPN: K4G80325FB-HC28
  • 8-Layer, FR4, Lead-Free, Halogen-Free - MFG: NAN YA PCB CORP
  • Enclosure, Console, Main Chassis, Stamped/Formed Electro-Galvanized Steel, w/ 14 Metal Tabs, w/ 52 Stamped Aluminum Fins, w/ 3 Copper Heat Exchange Pipes, w/ 1 Plated Metal Insert, w/ White Mylar Label
  • SGRAM, GDDR5, 1GB - MFG: SAMSUNG SEMICONDUCTOR INC - MPN: K4G80325FB-HC28
  • ASIC - MFG: MARVELL SEMICONDUCTOR INC - MPN: CXD90036G
  • Bluetooth/NFC/WLAN, SoC, IEEE802.11a/b/g/n/ac, 2x2 MIMO, Bluetooth 4.0+HS, NFC - MFG: MARVELL SEMICONDUCTOR INC - MPN: 88W8897M-NMJ2

Playstation 4 _Main PCD Top Playstation 4 _Main PCD Top



Powered by CR4, the Engineering Community

Discussion – 0 comments

By posting a comment you confirm that you have read and accept our Posting Rules and Terms of Use.
Engineering Newsletter Signup
Get the Engineering360
Stay up to date on:
Features the top stories, latest news, charts, insights and more on the end-to-end electronics value chain.
Advertisement
Weekly Newsletter
Get news, research, and analysis
on the Electronics industry in your
inbox every week - for FREE
Sign up for our FREE eNewsletter
Advertisement

CALENDAR OF EVENTS

Date Event Location
30 Jul-03 Aug 2017 Los Angeles, California
12-14 Sep 2017 Novi, MI
Find Free Electronics Datasheets
Advertisement