Mouser, Renesas Team on MCUs, Design Tools for IoT
|30 May-02 Jun 2017||Lake Buena Vista, Florida USA|
|04-09 Jun 2017||Honolulu, Hawaii, USA|
The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the Components, Packaging and Manufacturing Technology (CPMT) Society of the IEEE.
The IEEE MTT International Microwave Symposium (IMS) is the premier annual international meeting for technologists involved in all aspects of microwave theory and practice. It consists of a full week of events, including technical paper presentations, workshops, and tutorials, as well as numerous social events and networking opportunities. The symposium also hosts a large commercial exhibition. Co-located with IMS are the IEEE RFIC and ARFTG conferences.