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Aerospace

MLCCs with Tin/Lead Terminals Suit Defense Apps

06 March 2017

KEMET Corporation has expanded its Multilayer Ceramic Capacitor (MLCC) product line to include a tin/lead termination option. Available in EIA 1210 and 2220 case sizes, KPS “L” termination commercial capacitors allow designers to meet the needs of defense, avionic and industrial applications requiring a more robust termination system that helps mitigate tin whisker growth.

KPS utilizes a proprietary lead-frame technology to vertically stack one or two MLCCs in a parallel circuit configuration in a single compact surface mount package. The attached lead-frame mechanically isolates the capacitors from the printed circuit board, offering advanced mechanical and thermal stress performance. Isolation also addresses concerns for audible, microphonic noise that may occur when a bias voltage is applied. A two-chip stack offers up to double the capacitance in the same or smaller design footprint when compared to traditional surface mount MLCC devices.

Typical applications include smoothing circuits, DC/DC converters, power supplies and noise reduction circuits with a direct battery or power source connection. KPS “L” capacitors are suited for any application subject to high levels of board flexure or temperature cycling.



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