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Aerospace

High-Performance HD Video Interface Suits Vision, Surveillance Applications

13 December 2016

THine Electronics’s single-chip solution integrates the MIPI CSI-2 interface with THine’s V-by-One®?HS product family. Source: THine Electronics. THine Electronics’s single-chip solution integrates the MIPI CSI-2 interface with THine’s V-by-One®?HS product family. Source: THine Electronics. THine Electronics, Inc. has announced an AEC-Q100 (Grade 2)-compliant single-chip solution (THCV241-Q) that integrates the MIPI CSI-2 interface with THine’s V-by-One® HS product family.
The THCV241-Q is optimized for advanced camera requirements, including  high-definition support (e.g., 1080p60, 4K2K). It achieves a  50× increase in maximum transmission distance—from 30 cm to 15 m; provides 360° rotation at an affordable price point; lowers bill of material costs; and allows smaller circuit boards for more compact designs, new product form factors and higher reliability.
Today’s high-resolution CMOS camera modules mainly use the MIPI CSI-2 protocol output for its high data rate, so transmission distance is limited to about 30 cm. However MIPI CSI-2 integrated into the THCV241-Q processor chip extends cable length to 15 meters for uncompressed 1080p60 video data via a shielded twisted pair or a single coaxial line. In cars, for example, a clear rear-view image is available at any point inside the vehicle without compression-induced latency. High dynamic range image displays in vehicles achieve high clarity.
THine also offers various receiver chips that support 150 MHz parallel output and Open LDI (LVDS) output for two-megapixel images or 1080p60, and plans to develop more lineups. In addition, because the THCV241-Q processor supports transmission through a slip ring, PTZ cameras do not need close proximity to the application processor. The THCV241-Q’s video transmission performance also reduces costs and camera system size restrictions. For example, compared with Open LDI (LVDS) transmission, THCV241-Q transmission requires only one-fourth as many expensive slip- ring cores, for a 75% cost reduction in the internal interfaces of PTZ cameras.
Samples are scheduled for release in December 2016. 



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