Acquired Electronics360

Aerospace

Dual-Channel LVDS Buffer Devices Combine High Performance, Low Power

01 December 2016

IDT® 8P34S LVDS buffer. Source: IDT. IDT® 8P34S LVDS buffer. Source: IDT. Integrated Device Technology, Inc. (IDT) has introduced four high-performance, low-power, LVDS dual-channel fanout buffers, delivering high performance and power savings for system and board designers. Ideal for wireless infrastructure and other communications equipment, the 1.8 V members of the IDT® 8P34S buffer family enable the simultaneous fanout of high-frequency clock and data signals, with very low additive phase jitter of typically less than 45 femtoseconds.

Each of the devices’ two independent buffer channels offers up to eight low-skew outputs. Effective isolation between channels minimizes noise coupling. Alternating current characteristics, such as propagation delay, are matched between channels.

Delivering up to 50% lower power than comparable competitive devices, IDT’s dual-channel buffers allow board designers to reduce power consumption while maintaining clock performance. The buffers also enable engineers to move to lower supply rails in support of deeper submicron silicon processes.

The devices enable two different signals to be buffered while remaining synchronous with one another. One channel can be used for a clock; the other can be used for a synchronization signal or data, as applicable in device clock and SYSREF signal distribution in JESD204B applications. The power reduction allows higher system packing densities, saves cost in the power supply and cooling, and delivers lower power footprints.

The buffers’ low additive phase jitter, high spurious attenuation and low clock output skew are combined with high clock frequency support. Their compatibility with LVDS devices make them easy to use, and they are compatible in pin and function to equivalent industry standard 2.5 V and 3.3 V parts from IDT.



Powered by CR4, the Engineering Community

Discussion – 0 comments

By posting a comment you confirm that you have read and accept our Posting Rules and Terms of Use.
Engineering Newsletter Signup
Get the Engineering360
Stay up to date on:
Features the top stories, latest news, charts, insights and more on the end-to-end electronics value chain.
Advertisement
Weekly Newsletter
Get news, research, and analysis
on the Electronics industry in your
inbox every week - for FREE
Sign up for our FREE eNewsletter
Advertisement

CALENDAR OF EVENTS

Date Event Location
30 Nov-01 Dec 2017 Helsinki, Finland
23-27 Apr 2018 Oklahoma City, Oklahoma
18-22 Jun 2018 Honolulu, Hawaii
Find Free Electronics Datasheets
Advertisement