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Aerospace

Ultra-thin Substrate Integrates ESD Protection

27 November 2016

CeraPad™ ceramic substrate. Source: TDK. CeraPad™ ceramic substrate. Source: TDK. TDK Corporation has unveiled CeraPad™, an ultra-thin ceramic substrate with integrated ESD protection within its multilayer structure that eliminates the need for discrete ESD components. The innovative substrate meets the demands for maximum miniaturization coupled with the best ESD protection, and thus enables the highest degree of ESD integration in sensitive applications.

CeraPad’s™ ESD strength of up to 25 kV is more than three times higher than the standard 8 kV of state-of-the-art Zener diodes. Moreover the ceramic substrate features a high thermal conductivity of 22 W/mK that is more than three times better than that of conventional carriers, even though it is significantly slimmer with a thickness of just 300 µm to 400 µm.

Depending on customer requirements, the CeraPad™ contact pads can be designed for both standard SAC (Sn/Ag/Cu, 260° C) reflow processes and gold-tin eutectic bonding.

The technology is especially well suited for LED applications where the number and density of LEDs per unit continue to grow. CeraPad™ enables customized chip-scale packages (CSP) for standard LED elements from CSP1515 down to CSP0707. A further advantage is CeraPad's™ low coefficient of thermal expansion (6 ppm/mK), which is almost identical to that of LEDs. As a result, there is nearly no mechanical stress between substrate and LED when the temperature changes.

Similar to printed circuit boards, CeraPad’s™ multilayer technology can be leveraged to design a kind of integrated circuit by interconnecting the internal redistribution layers with vias. As a rule, today’s matrix LEDs consist of several dual LEDs connected in series. By contrast, the new CeraPad™ module now enables, for the first time, a new kind of LED matrix array with up to hundreds of LED light points that can be individually controlled.

Application designers will be able to use this technology to create innovative high-resolution and safety-relevant light effects in the smallest of spaces, for example, in multiple LED flashes in smartphones or in adaptive headlights in cars.



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