This interconnect device is constructed from a low durometer silicone core that is wrapped with 166 parallel rows of flat, gold-plated copper wires per inch. This construction allows the connector to accommodate PCBs with pad center spacing down to 0.15 mm. Additionally, each 0.025 mm x 0.076 mm gold-plated element delivers a current carrying capacity of 250 mA with a typical electrical resistance of less than 25 milliohms.
Fujipoly’s Zebra® Gold Series 8000C is suited for many board-to-board electronic packaging application with tight pad spacing and board separation tolerances. This connector can be specified in custom lengths from .200 in. to 6.00 in. and heights ranging from .10 in. to 1.0 in.